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- Packaging：
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- Operating Temperature：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Material - Mating：
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- Conditions sélectionnées:
Découvrez les produits 27,393
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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3M |
1,022
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 14POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
1,089
|
3 jours |
-
|
MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET ZIF 16POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
112
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
Aries Electronics |
2,009
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS GLD
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Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Gold | - | Beryllium Copper | ||
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|
|
3M |
688
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
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3M |
683
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SOIC 8POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 8 (2 x 4) | - | Gold | 30μin (0.76μm) | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
1,515
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS GLD
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Tube | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
337
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 16POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 16 (2 x 8) | - | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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Apex Microtechnology |
999
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-3 8POS GOLD
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Bulk | Apex Precision Power | - | Through Hole | Transistor，TO-3 | Closed Frame | Solder | Polyester，Glass Filled | 8 (Oval) | - | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass | ||
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|
|
3M |
193
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
150
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP ZIF 10POS GOLD
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Bulk | Textool | -55°C ~ 125°C | Through Hole | SIP，ZIF (ZIP) | - | Solder | Polysulfone (PSU)，Glass Filled | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
249
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS GLD
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Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
179
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP ZIF 20POS GOLD
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Bulk | Textool | -55°C ~ 125°C | Through Hole | SIP，ZIF (ZIP) | - | Solder | Polysulfone (PSU)，Glass Filled | 20 (1 x 20) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
|
3M |
138
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP ZIF 24POS GOLD
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Bulk | Textool | -55°C ~ 125°C | Through Hole | SIP，ZIF (ZIP) | - | Solder | Polysulfone (PSU)，Glass Filled | 24 (1 x 24) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
149
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 121POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | PGA，ZIF (ZIP) | - | Solder | Polyethersulfone (PES) | 121 (11 x 11) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
180
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | PGA，ZIF (ZIP) | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | - | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
3M |
110
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 225POS GOLD
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Bulk | Textool | -55°C ~ 150°C | - | PGA，ZIF (ZIP) | - | - | Polyethersulfone (PES) | 225 (15 x 15) | 0.100" (2.54mm) | - | - | - | 0.100" (2.54mm) | - | - | - | ||
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|
|
3M |
72
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET QFN 64POS GOLD
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Bulk | Textool | - | Through Hole | QFN | Open Frame | Solder | Polyethersulfone (PES) | 64 (4 x 16) | 0.020" (0.50mm) | Gold | - | Beryllium Copper | 0.020" (0.50mm) | Gold | - | Beryllium Copper | ||
|
|
|
3M |
43
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET QFN 88POS GOLD
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Tray | Textool | - | Through Hole | QFN | Open Frame | Solder | Polyethersulfone (PES) | 88 (4 x 22) | 0.016" (0.40mm) | Gold | - | Beryllium Copper | 0.016" (0.40mm) | Gold | - | Beryllium Copper | ||
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|
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On Shore Technology Inc. |
17,786
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS TIN
|
Tube | ED | -55°C ~ 110°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze |
