- Packaging：
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- Series：
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- Operating Temperature：
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- Mounting Type：
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- Features：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 378
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Aries Electronics |
660
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3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
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Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
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Mill-Max Manufacturing Corp. |
998
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
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Tube | 110 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 10 (2 x 5)，8 Loaded | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
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Aries Electronics |
1,148
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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Aries Electronics |
268
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS TIN
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Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Horizontal | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 10 (2 x 5) | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
588
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | -55°C ~ 105°C | Through Hole，Right Angle，Horizontal | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
4,093
|
3 jours |
-
|
MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 10POS TIN
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 10 (2 x 5) | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
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|
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Aries Electronics |
1,234
|
3 jours |
-
|
MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 10 (2 x 5) | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
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Aries Electronics |
178
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
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Bulk | Vertisockets 800 | -55°C ~ 105°C | Through Hole，Right Angle，Horizontal | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 16 (2 x 8) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
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Mill-Max Manufacturing Corp. |
170
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Tube | 111 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 10 (2 x 5) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
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Aries Electronics |
507
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
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Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 8 (2 x 4) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
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Aries Electronics |
27
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Horizontal | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 10 (2 x 5) | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Mill-Max Manufacturing Corp. |
123
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 10 (2 x 5)，6 Loaded | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
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Aries Electronics |
39
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS GOLD
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Bulk | 503 | -55°C ~ 105°C | Through Hole | Closed Frame | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | 8 (2 x 4) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
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Aries Electronics |
23
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS GOLD
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Bulk | 518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 16 (2 x 8) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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Aries Electronics |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
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Aries Electronics |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
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|
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Aries Electronics |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
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Aries Electronics |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS TIN
|
Bulk | 8 | -55°C ~ 105°C | Through Hole | Closed Frame，Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
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|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS TINLEAD
|
Tube | 299 | -55°C ~ 125°C | Through Hole，Right Angle，Vertical | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 10 (2 x 5) | Tin-Lead | 100μin (2.54μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy |
