Douilles pour circuits intégrés, transistors - Zui Ai Technology（Taiwan）Company.

Packaging：

Series：

Operating Temperature：

Mounting Type：

Type：

Features：

Termination：

Number of Positions or Pins (Grid)：

10 (1 x 10) (3)
10 (2 x 5) (2)
11 (1 x 11) (1)
12 (1 x 12) (2)
13 (1 x 13) (1)
14 (1 x 14) (2)
14 (2 x 7) (4)
15 (1 x 15) (2)
16 (1 x 16) (3)
16 (2 x 8) (4)
17 (1 x 17) (1)
18 (2 x 9) (4)
2 (1 x 2) (3)
20 (1 x 20) (4)
20 (2 x 10) (4)
20 (4 x 5) (2)
21 (1 x 21) (1)
22 (2 x 11) (2)
24 (2 x 12) (82)
27 (1 x 27) (2)
28 (2 x 14) (76)
28 (4 x 7) (2)
3 (1 x 3) (1)
3 (Rectangular) (1)
30 (1 x 30) (1)
32 (1 x 32) (4)
32 (2 x 16) (76)
36 (2 x 18) (69)
4 (1 x 4) (2)
40 (2 x 20) (74)
42 (2 x 21) (74)
44 (2 x 22) (74)
44 (4 x 11) (1)
48 (2 x 24) (72)
5 (1 x 5) (3)
52 (4 x 13) (1)
6 (1 x 6) (3)
6 (2 x 3) (2)
68 (4 x 17) (5)
7 (1 x 7) (2)
8 (1 x 8) (3)
8 (2 x 4) (4)
84 (4 x 21) (2)
9 (1 x 9) (1)

Pitch - Mating：

Contact Finish - Mating：

Contact Finish Thickness - Mating：

Contact Material - Mating：

Pitch - Post：

Contact Finish - Post：

Contact Finish Thickness - Post：

Contact Material - Post：

Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
	28-6554-10	Aries Electronics	269	3 jours	-	CONN IC DIP SOCKET ZIF 28POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 28POS TIN	Bulk	55	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	28 (2 x 14)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	32-6554-10	Aries Electronics	632	3 jours	-	CONN IC DIP SOCKET ZIF 32POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 32POS TIN	Bulk	55	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	32 (2 x 16)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	24-6554-11	Aries Electronics	364	3 jours	-	CONN IC DIP SOCKET ZIF 24POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 24POS GLD	Bulk	55	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	24 (2 x 12)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Gold	-	Beryllium Copper
	40-6554-10	Aries Electronics	182	3 jours	-	CONN IC DIP SOCKET ZIF 40POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 40POS TIN	Bulk	55	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	40 (2 x 20)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	28-6554-11	Aries Electronics	2,051	3 jours	-	CONN IC DIP SOCKET ZIF 28POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 28POS GLD	Bulk	55	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	28 (2 x 14)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Gold	-	Beryllium Copper
	48-6554-11	Aries Electronics	2,009	3 jours	-	CONN IC DIP SOCKET ZIF 48POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 48POS GLD	Bulk	55	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	48 (2 x 24)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Gold	-	Beryllium Copper
	24-6554-10	Aries Electronics	122	3 jours	-	CONN IC DIP SOCKET ZIF 24POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 24POS TIN	Bulk	55	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	24 (2 x 12)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	48-6554-10	Aries Electronics	499	3 jours	-	CONN IC DIP SOCKET ZIF 48POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 48POS TIN	Bulk	55	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	48 (2 x 24)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	268-5401-00-1102JH	3M	130	3 jours	-	CONN SOCKET CLCC 68POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET CLCC 68POS GOLD	Tray	OEM	-55°C ~ 105°C	Through Hole	CLCC	Closed Frame	Solder	68 (4 x 17)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper
	24-6554-16	Aries Electronics	160	3 jours	-	CONN IC DIP SOCKET ZIF 24POS MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 24POS	Bulk	55	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	24 (2 x 12)	0.100" (2.54mm)	Nickel Boron	50μin (1.27μm)	Beryllium Copper	0.100" (2.54mm)	Nickel Boron	50μin (1.27μm)	Beryllium Copper
	40-6554-11	Aries Electronics	50	3 jours	-	CONN IC DIP SOCKET ZIF 40POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 40POS GLD	Bulk	55	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Gold	-	Beryllium Copper
	203-2737-55-1102	3M	45	3 jours	-	CONN TRANSIST TO-3/TO-66 3POS MOQ: 1 MPQ: 1	CONN TRANSIST TO-3/TO-66 3POS	Bulk	Textool	-55°C ~ 150°C	Through Hole	Transistor，TO-3 and TO-66	Closed Frame	Solder	3 (Rectangular)	-	Gold	30μin (0.76μm)	Beryllium Copper	0.234" (5.94mm)	Gold	30μin (0.76μm)	Beryllium Copper
	44-547-11E	Aries Electronics	16	3 jours	-	CONN SOCKET SOIC ZIF 44POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SOIC ZIF 44POS GOLD	Bulk	547	-	Through Hole	SOIC，ZIF (ZIP)	Closed Frame	Solder	44 (2 x 22)	-	Gold	20μin (0.51μm)	Beryllium Copper	0.050" (1.27mm)	Gold	20μin (0.51μm)	Beryllium Copper
	44-547-11	Aries Electronics	8	3 jours	-	CONN SOCKET SOIC ZIF 44POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SOIC ZIF 44POS GOLD	Bulk	547	-	Through Hole	SOIC，ZIF (ZIP)	Closed Frame	Solder	44 (2 x 22)	-	Gold	20μin (0.51μm)	Beryllium Copper	0.050" (1.27mm)	Gold	20μin (0.51μm)	Beryllium Copper
	24-6574-10	Aries Electronics	40	3 jours	-	CONN IC DIP SOCKET ZIF 24POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 24POS TIN	Bulk	57	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	24 (2 x 12)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	40-6574-10	Aries Electronics	38	3 jours	-	CONN IC DIP SOCKET ZIF 40POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 40POS TIN	Bulk	57	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	40 (2 x 20)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	32-6554-11	Aries Electronics	64	3 jours	-	CONN IC DIP SOCKET ZIF 32POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 32POS GLD	Bulk	55	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	32 (2 x 16)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Gold	-	Beryllium Copper
	28-6574-10	Aries Electronics	4	3 jours	-	CONN IC DIP SOCKET ZIF 28POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 28POS TIN	Bulk	57	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	28 (2 x 14)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	32-6574-10	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET ZIF 32POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 32POS TIN	Bulk	57	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	32 (2 x 16)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	48-6574-10	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET ZIF 48POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 48POS GLD	Bulk	57	-	Through Hole	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	48 (2 x 24)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Beryllium Copper	0.100" (2.54mm)	Gold	10μin (0.25μm)	Beryllium Copper

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