- Mounting Type：
-
- Features：
-
- Housing Material：
-
- Pitch - Mating：
-
- Contact Finish Thickness - Mating：
-
- Contact Material - Mating：
-
- Pitch - Post：
-
- Contact Finish Thickness - Post：
-
- Conditions sélectionnées:
Découvrez les produits 8
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Mounting Type | Type | Features | Housing Material | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Mounting Type | Type | Features | Housing Material | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | |
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BGA PIN ADAPTER 1.27MM SMD
|
550 | Through Hole | BGA | Closed Frame | FR4 Epoxy Glass | 0.050" (1.27mm) | 10μin (0.25μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET BGA 360POS GOLD
|
514 | Surface Mount | BGA | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | - | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET BGA 360POS GOLD
|
514 | Surface Mount | BGA | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.100" (2.54mm) | 29.5μin (0.75μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | - | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BGA SOLDER TAIL
|
550 | Through Hole | BGA | Closed Frame | FR4 Epoxy Glass | 0.050" (1.27mm) | 10μin (0.25μm) | Brass | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PGA SOLDER TAIL 1.27MM
|
558 | Through Hole | PGA | Closed Frame | FR4 Epoxy Glass | 0.050" (1.27mm) | 10μin (0.25μm) | Beryllium Copper | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BGA SURFACE MOUNT 1.27MM
|
558 | Surface Mount | BGA | Closed Frame | FR4 Epoxy Glass | 0.050" (1.27mm) | 10μin (0.25μm) | Brass | 0.050" (1.27mm) | Gold | 10μin (0.25μm) | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 360POS GOLD
|
518 | Through Hole | PGA | Open Frame | FR4 Epoxy Glass | 0.050" (1.27mm) | Flash | Beryllium Copper | 0.050" (1.27mm) | Gold | Flash | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 360POS GOLD
|
518 | Surface Mount | PGA | Open Frame | FR4 Epoxy Glass | 0.050" (1.27mm) | Flash | Beryllium Copper | 0.050" (1.27mm) | Gold | Flash |
