- Packaging：
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- Series：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 976
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Aries Electronics |
269
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET ZIF 28POS TIN
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Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Tin | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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|
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Aries Electronics |
632
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 32POS TIN
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Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Tin | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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|
|
Aries Electronics |
182
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS TIN
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Tin | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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|
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Mill-Max Manufacturing Corp. |
3,529
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN-LEAD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Tin-Lead | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
|
Mill-Max Manufacturing Corp. |
2,707
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TINLEAD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Tin-Lead | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
|
Mill-Max Manufacturing Corp. |
3,065
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TINLEAD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Tin-Lead | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
2,060
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TINLEAD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 20 (2 x 10) | 0.100" (2.54mm) | Tin-Lead | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
3,250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS TINLEAD
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Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 32 (2 x 16) | 0.100" (2.54mm) | Tin-Lead | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
122
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS TIN
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Tin | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
499
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS TIN
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Tin | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Mill-Max Manufacturing Corp. |
270
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS TINLEAD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.9" (22.86mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | 0.100" (2.54mm) | Tin-Lead | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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|
Aries Electronics |
200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
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Bulk | 8 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame，Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Tin | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
268
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS TIN
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Horizontal | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 10 (2 x 5) | 0.100" (2.54mm) | Tin | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
4,093
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS TIN
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 10 (2 x 5) | 0.100" (2.54mm) | Tin | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
1,020
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Horizontal | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 14 (2 x 7) | 0.100" (2.54mm) | Tin | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
929
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | 18 (2 x 9) | 0.100" (2.54mm) | Tin | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
356
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PQFP 100POS TIN-LEAD
|
Tube | - | - | Through Hole | QFP | Closed Frame | Solder | Liquid Crystal Polymer (LCP) | 100 (4 x 25) | 0.050" (1.27mm) | Tin-Lead | Phosphor Bronze | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
392
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-3 3POS TIN-LEAD
|
Bulk | 8080 | -55°C ~ 125°C | Chassis Mount | Transistor，TO-3 | Closed Frame | Solder | Fluoropolymer (FP) | 3 (Oval) | - | Tin-Lead | Beryllium Copper | - | Tin-Lead | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Mill-Max Manufacturing Corp. |
989
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TINLEAD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Tin-Lead | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
894
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TINLEAD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Tin-Lead | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy |
