- Series：
-
- Operating Temperature：
-
- Mounting Type：
-
- Type：
-
- Features：
-
- Termination：
-
- Housing Material：
-
- Number of Positions or Pins (Grid)：
-
- Contact Finish - Mating：
-
- Contact Material - Mating：
-
- Pitch - Post：
-
- Contact Finish - Post：
-
- Contact Finish Thickness - Post：
-
- Contact Material - Post：
-
- Conditions sélectionnées:
Découvrez les produits 14
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|
|
|
On Shore Technology Inc. |
2,015
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 8 (2 x 4) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
On Shore Technology Inc. |
2,681
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 6 (2 x 3) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
On Shore Technology Inc. |
1,712
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 16 (2 x 8) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
On Shore Technology Inc. |
121
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 24 (2 x 12) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
On Shore Technology Inc. |
721
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 20 (2 x 10) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
On Shore Technology Inc. |
187
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 14 (2 x 7) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
On Shore Technology Inc. |
43
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 40 (2 x 20) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
On Shore Technology Inc. |
32
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 18 (2 x 9) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
On Shore Technology Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 22POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.4" (10.16mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 22 (2 x 11) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
On Shore Technology Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 28 (2 x 14) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
On Shore Technology Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 48 (2 x 24) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
ASSMANN WSW Components |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOCKET 20 CONTACTS SINGLE ROW
|
Bulk | - | -40°C ~ 105°C | Through Hole | - | - | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 20 (1 x 20) | Nickel | Brass | 0.100" (2.54mm) | Nickel | 78.7μin (2.00μm) | Brass | ||
|
|
|
On Shore Technology Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 64 (2 x 32) | Gold | Beryllium Copper | 0.100" (2.54mm) | Copper | Flash | Brass | ||
|
|
|
ASSMANN WSW Components |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS TIN
|
- | - | - | Through Hole | SIP | Closed Frame | - | - | 20 (1 x 20) | Tin | - | - | - | - | - |
