- Series:
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- Operating Temperature:
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- Mounting Type:
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- Type:
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- Features:
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- Termination:
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- Housing Material:
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- Number of Positions or Pins (Grid):
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- Pitch - Mating:
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- Contact Finish - Mating:
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- Contact Finish Thickness - Mating:
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- Contact Material - Mating:
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- Pitch - Post:
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- Contact Finish - Post:
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- Conditions sélectionnées:
Découvrez les produits 244
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | ||
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | ||
Molex,LLC |
96,800
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 32POS GOLD
|
Tape & Reel (TR) | 105028 | - | Surface Mount | Camera Socket | Open Frame | Solder | Thermoplastic | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Nickel | 50μin (1.27μm) | ||||
Molex,LLC |
97,189
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 32POS GOLD
|
Cut Tape (CT) | 105028 | - | Surface Mount | Camera Socket | Open Frame | Solder | Thermoplastic | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Nickel | 50μin (1.27μm) | ||||
Molex,LLC |
97,189
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 32POS GOLD
|
- | 105028 | - | Surface Mount | Camera Socket | Open Frame | Solder | Thermoplastic | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Nickel | 50μin (1.27μm) | ||||
3M |
6,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Tape & Reel (TR) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 32 (2 x 7,2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | ||||
3M |
6,697
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Cut Tape (CT) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 32 (2 x 7,2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | ||||
3M |
6,697
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
- | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 32 (2 x 7,2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | ||||
3M |
1,440
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tape & Reel (TR) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | ||||
3M |
1,583
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Cut Tape (CT) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | ||||
3M |
1,583
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
- | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | ||||
3M |
3,289
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | ||||
Mill-Max Manufacturing Corp. |
4,274
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Tube | 540 | -55°C ~ 125°C | Surface Mount | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 32 (2 x 7,2 x 9) | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | ||||
Amphenol FCI |
8,538
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 100μin (2.54μm) | ||||
Amphenol FCI |
25,910
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | -55°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA),Nylon | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | ||||
Amphenol FCI |
5,564
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | -55°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA),Nylon | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | ||||
Amphenol FCI |
22,435
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -55°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA),Nylon | 16 (2 x 8) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | ||||
Amphenol FCI |
5,641
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
|
Tube | - | -55°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA),Nylon | 20 (2 x 10) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | ||||
Amphenol FCI |
13,070
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | - | -55°C ~ 105°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyamide (PA),Nylon | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | ||||
Amphenol FCI |
9,259
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
Tube | - | -55°C ~ 105°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyamide (PA),Nylon | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | ||||
3M |
2,250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 28POS TIN
|
Tape & Reel (TR) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 28 (4 x 7) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | ||||
3M |
2,695
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 28POS TIN
|
Cut Tape (CT) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 28 (4 x 7) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) |