- Series:
-
- Operating Temperature:
-
- Mounting Type:
-
- Type:
-
- Features:
-
- Number of Positions or Pins (Grid):
-
- Contact Finish Thickness - Mating:
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- Contact Material - Mating:
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- Contact Finish Thickness - Post:
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- Contact Material - Post:
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- Conditions sélectionnées:
Découvrez les produits 22
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
Harwin Inc. |
1,030
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 8 (2 x 4) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
627
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 28 (2 x 14) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
499
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 14 (2 x 7) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
763
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 16 (2 x 8) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
238
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 18 (2 x 9) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
535
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 20 (2 x 10) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
572
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 22POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.4" (10.16mm) Row Spacing | Open Frame | 22 (2 x 11) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
674
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 28 (2 x 14) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
351
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 24 (2 x 12) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
185
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 32 (2 x 16) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
1
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 40 (2 x 20) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 24 (2 x 12) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 6 (2 x 3) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Molex,LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 34POS GOLD
|
Tape & Reel (TR) | 105199 | -30°C ~ 85°C | Surface Mount | Camera Socket | Closed Frame | 34 (2 x 8,2 x 9) | 0.024" (0.60mm) | 12μin (0.30μm) | Copper Alloy | 0.024" (0.60mm) | - | - | Copper Alloy | ||||
Molex,LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 24POS GOLD
|
Tape & Reel (TR) | 78499 | -55°C ~ 85°C | Surface Mount | Camera Socket | Closed Frame | 24 (2 x 4,2 x 8) | 0.024" (0.60mm) | 12μin (0.30μm) | Copper Alloy | 0.024" (0.60mm) | Gold | Flash | Copper Alloy | ||||
Molex,LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN CAMERA SOCKET 32POS GOLD
|
Tape & Reel (TR) | 105028 | - | Surface Mount | Camera Socket | Open Frame | 32 (4 x 8) | 0.035" (0.90mm) | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Gold | Flash | Copper Alloy | ||||
Molex,LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN CAMERA SOCKET 32POS GOLD
|
Cut Tape (CT) | 105028 | - | Surface Mount | Camera Socket | Open Frame | 32 (4 x 8) | 0.035" (0.90mm) | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Gold | Flash | Copper Alloy | ||||
Molex,LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN CAMERA SOCKET 32POS GOLD
|
- | 105028 | - | Surface Mount | Camera Socket | Open Frame | 32 (4 x 8) | 0.035" (0.90mm) | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Gold | Flash | Copper Alloy | ||||
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 22POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.4" (10.16mm) Row Spacing | Open Frame | 22 (2 x 11) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | D2 | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 48 (2 x 24) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass |