Découvrez les produits 23
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Series Operating Temperature Mounting Type Type Features Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post
DILB8P-223TLF
Amphenol FCI
25,910
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 8POS TIN
Tube - -55°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame 8 (2 x 4) 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy
DILB14P-223TLF
Amphenol FCI
5,564
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 14POS TIN
Tube - -55°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame 14 (2 x 7) 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy
DILB16P-223TLF
Amphenol FCI
22,435
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 16POS TIN
Tube - -55°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame 16 (2 x 8) 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy
DILB20P-223TLF
Amphenol FCI
5,641
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 20POS TIN
Tube - -55°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame 20 (2 x 10) 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy
DILB28P-223TLF
Amphenol FCI
13,070
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 28POS TIN
Tube - -55°C ~ 105°C Through Hole DIP,0.6" (15.24mm) Row Spacing Open Frame 28 (2 x 14) 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy
DILB40P-223TLF
Amphenol FCI
9,259
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 40POS TIN
Tube - -55°C ~ 105°C Through Hole DIP,0.6" (15.24mm) Row Spacing Open Frame 40 (2 x 20) 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy
473370001
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN CAM SOCKET 24POS GOLD
Tape & Reel (TR) 47337 -55°C ~ 85°C Surface Mount Camera Socket Open Frame 24 (4 x 6) 0.035" (0.90mm) Gold 12μin (0.30μm) Copper Alloy 0.035" (0.90mm) Gold Flash Copper Alloy
473370001
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN CAM SOCKET 24POS GOLD
Cut Tape (CT) 47337 -55°C ~ 85°C Surface Mount Camera Socket Open Frame 24 (4 x 6) 0.035" (0.90mm) Gold 12μin (0.30μm) Copper Alloy 0.035" (0.90mm) Gold Flash Copper Alloy
473370001
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN CAM SOCKET 24POS GOLD
- 47337 -55°C ~ 85°C Surface Mount Camera Socket Open Frame 24 (4 x 6) 0.035" (0.90mm) Gold 12μin (0.30μm) Copper Alloy 0.035" (0.90mm) Gold Flash Copper Alloy
8059-2G2
TE Connectivity AMP Connectors
193
3 jours
-
MOQ: 1  MPQ: 1
CONN TRANSIST TO-5 3POS GOLD
Bulk 8059 -55°C ~ 125°C Through Hole Transistor,TO-5 - 3 (Round) - Gold - Copper Alloy - Gold - Copper Alloy
8059-2G1
TE Connectivity AMP Connectors
794
3 jours
-
MOQ: 1  MPQ: 1
CONN TRANSIST TO-5 3POS GOLD
Bulk 8059 -55°C ~ 125°C Through Hole Transistor,TO-5 - 3 (Round) - Gold - Copper Alloy - Gold - Copper Alloy
8059-2G9
TE Connectivity AMP Connectors
367
3 jours
-
MOQ: 1  MPQ: 1
CONN TRANSIST TO-5 3POS GOLD
Bulk 8059 -55°C ~ 125°C Through Hole Transistor,TO-5 - 3 (Round) - Gold - Copper Alloy - Gold - Copper Alloy
DILB18P-223TLF
Amphenol FCI
Enquête
-
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 18POS TINLEAD
Tube DILB -55°C ~ 125°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame 18 (2 x 9) 0.100" (2.54mm) Tin-Lead 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin-Lead 100μin (2.54μm) Copper Alloy
DILB24P-224TLF
Amphenol FCI
Enquête
-
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 24POS TINLEAD
Tube DILB -55°C ~ 125°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin-Lead 100μin (2.54μm) Copper Alloy
DILB24P-223TLF
Amphenol FCI
Enquête
-
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 24POS TINLEAD
Tube DILB -55°C ~ 125°C Through Hole DIP,0.6" (15.24mm) Row Spacing Open Frame 24 (2 x 12) 0.100" (2.54mm) Tin-Lead 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin-Lead 100μin (2.54μm) Copper Alloy
DILB32P-223TLF
Amphenol FCI
Enquête
-
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 32POS TINLEAD
Tube DILB -55°C ~ 125°C Through Hole DIP,0.6" (15.24mm) Row Spacing Open Frame 32 (2 x 16) 0.100" (2.54mm) Tin-Lead 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin-Lead 100μin (2.54μm) Copper Alloy
DILB42P-223TLF
Amphenol FCI
Enquête
-
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 42POS TINLEAD
Tube DILB -55°C ~ 125°C Through Hole DIP,0.6" (15.24mm) Row Spacing Open Frame 42 (2 x 21) 0.100" (2.54mm) Tin-Lead 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin-Lead 100μin (2.54μm) Copper Alloy
8059-2G5
TE Connectivity AMP Connectors
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET TRANSIST TO-5 8POS
Bulk - -55°C ~ 125°C Through Hole Transistor,TO-5 Closed Frame 8 (Round) - Gold - Copper Alloy - Gold - Copper Alloy
SIP41430-001LF
Amphenol FCI
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET SIP 2POS TIN
Tape & Reel (TR) - - Surface Mount SIP Closed Frame 2 (1 x 2) 0.100" (2.54mm) Tin 200μin (5.08μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Beryllium Copper
8059-2G6
TE Connectivity AMP Connectors
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET TRANSIST TO-5 8POS
Bulk - -55°C ~ 125°C Through Hole Transistor,TO-5 Closed Frame 8 (Round) - Gold - Copper Alloy - Tin - Copper Alloy