Douilles pour circuits intégrés, transistors - Zui Ai Technology（Taiwan）Company.

Packaging：

Series：

Operating Temperature：

Mounting Type：

Type：

Features：

Termination：

Housing Material：

Number of Positions or Pins (Grid)：

10 (1 x 10) (3)
10 (2 x 5) (4)
100 (4 x 25) (5)
132 (4 x 33) (4)
14 (2 x 7) (7)
144 (4 x 36) (2)
16 (2 x 8) (9)
160 (4 x 40) (2)
18 (2 x 9) (5)
20 (1 x 20) (2)
20 (2 x 10) (6)
20 (4 x 5) (5)
22 (2 x 11) (3)
24 (2 x 12) (13)
25 (1 x 25) (1)
28 (2 x 14) (9)
28 (4 x 7) (5)
3 (Oval) (6)
3 (Round) (1)
32 (1 x 32) (1)
32 (2 x 16) (9)
32 (2 x 7，2 x 9) (6)
36 (2 x 18) (1)
4 (1 x 4) (1)
4 (2 x 2) (1)
40 (2 x 20) (6)
42 (2 x 21) (3)
44 (4 x 11) (9)
48 (2 x 24) (2)
48 (4 x 12) (1)
50 (2 x 25) (2)
52 (2 x 26) (2)
52 (4 x 13) (5)
6 (1 x 6) (1)
6 (2 x 3) (2)
64 (1 x 64) (1)
64 (2 x 32) (2)
68 (4 x 17) (8)
8 (1 x 8) (2)
8 (2 x 4) (9)
84 (4 x 21) (6)

Pitch - Mating：

Contact Finish Thickness - Mating：

Contact Material - Mating：

Pitch - Post：

Contact Finish - Post：

Contact Finish Thickness - Post：

Contact Material - Post：

Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
	110-99-308-41-001000	Mill-Max Manufacturing Corp.	3,529	3 jours	-	CONN IC DIP SOCKET 8POS TIN-LEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS TIN-LEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	8 (2 x 4)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	214-99-308-01-670800	Mill-Max Manufacturing Corp.	4,396	3 jours	-	CONN IC DIP SOCKET 8POS TIN-LEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS TIN-LEAD	Tube	214	-55°C ~ 125°C	Surface Mount	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	8 (2 x 4)	0.100" (2.54mm)	100μin (2.54μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	110-99-314-41-001000	Mill-Max Manufacturing Corp.	2,707	3 jours	-	CONN IC DIP SOCKET 14POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS TINLEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	14 (2 x 7)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	110-99-316-41-001000	Mill-Max Manufacturing Corp.	3,065	3 jours	-	CONN IC DIP SOCKET 16POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS TINLEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	16 (2 x 8)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	110-99-320-41-001000	Mill-Max Manufacturing Corp.	2,060	3 jours	-	CONN IC DIP SOCKET 20POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS TINLEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	20 (2 x 10)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	110-99-632-41-001000	Mill-Max Manufacturing Corp.	3,250	3 jours	-	CONN IC DIP SOCKET 32POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 32POS TINLEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	32 (2 x 16)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	214-99-314-01-670800	Mill-Max Manufacturing Corp.	2,441	3 jours	-	CONN IC DIP SOCKET 14POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS TINLEAD	Tube	214	-55°C ~ 125°C	Surface Mount	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	14 (2 x 7)	0.100" (2.54mm)	100μin (2.54μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	214-99-316-01-670800	Mill-Max Manufacturing Corp.	2,487	3 jours	-	CONN IC DIP SOCKET 16POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS TINLEAD	Tube	214	-55°C ~ 125°C	Surface Mount	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	16 (2 x 8)	0.100" (2.54mm)	100μin (2.54μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	214-99-320-01-670800	Mill-Max Manufacturing Corp.	1,947	3 jours	-	CONN IC DIP SOCKET 20POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS TINLEAD	Tube	214	-55°C ~ 125°C	Surface Mount	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	20 (2 x 10)	0.100" (2.54mm)	100μin (2.54μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	110-99-964-41-001000	Mill-Max Manufacturing Corp.	270	3 jours	-	CONN IC DIP SOCKET 64POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 64POS TINLEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.9" (22.86mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	64 (2 x 32)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	214-99-632-01-670800	Mill-Max Manufacturing Corp.	1,638	3 jours	-	CONN IC DIP SOCKET 32POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 32POS TINLEAD	Tube	214	-55°C ~ 125°C	Surface Mount	DIP，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	32 (2 x 16)	0.100" (2.54mm)	100μin (2.54μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	214-99-640-01-670800	Mill-Max Manufacturing Corp.	222	3 jours	-	CONN IC DIP SOCKET 40POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 40POS TINLEAD	Tube	214	-55°C ~ 125°C	Surface Mount	DIP，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	40 (2 x 20)	0.100" (2.54mm)	100μin (2.54μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	821949-4	TE Connectivity AMP Connectors	356	3 jours	-	CONN SOCKET PQFP 100POS TIN-LEAD MOQ: 1 MPQ: 1	CONN SOCKET PQFP 100POS TIN-LEAD	Tube	-	-	Through Hole	QFP	Closed Frame	Solder	Liquid Crystal Polymer (LCP)	100 (4 x 25)	0.050" (1.27mm)	200μin (5.08μm)	Phosphor Bronze	0.050" (1.27mm)	Tin-Lead	200μin (5.08μm)	Phosphor Bronze
	8080-1G15	TE Connectivity AMP Connectors	392	3 jours	-	CONN TRANSIST TO-3 3POS TIN-LEAD MOQ: 1 MPQ: 1	CONN TRANSIST TO-3 3POS TIN-LEAD	Bulk	8080	-55°C ~ 125°C	Chassis Mount	Transistor，TO-3	Closed Frame	Solder	Fluoropolymer (FP)	3 (Oval)	-	200μin (5.08μm)	Beryllium Copper	-	Tin-Lead	200μin (5.08μm)	Beryllium Copper
	110-99-328-41-001000	Mill-Max Manufacturing Corp.	989	3 jours	-	CONN IC DIP SOCKET 28POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS TINLEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	28 (2 x 14)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	110-99-628-41-001000	Mill-Max Manufacturing Corp.	894	3 jours	-	CONN IC DIP SOCKET 28POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS TINLEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	28 (2 x 14)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	110-99-640-41-001000	Mill-Max Manufacturing Corp.	765	3 jours	-	CONN IC DIP SOCKET 40POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 40POS TINLEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	40 (2 x 20)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	110-99-324-41-001000	Mill-Max Manufacturing Corp.	811	3 jours	-	CONN IC DIP SOCKET 24POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS TINLEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	24 (2 x 12)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	110-99-624-41-001000	Mill-Max Manufacturing Corp.	179	3 jours	-	CONN IC DIP SOCKET 24POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS TINLEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	24 (2 x 12)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	110-99-424-41-001000	Mill-Max Manufacturing Corp.	360	3 jours	-	CONN IC DIP SOCKET 24POS TINLEAD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS TINLEAD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.4" (10.16mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	24 (2 x 12)	0.100" (2.54mm)	200μin (5.08μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy

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