- Series：
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- Mounting Type：
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- Type：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Conditions sélectionnées:
Découvrez les produits 300
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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|
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ASSMANN WSW Components |
47,594
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
On Shore Technology Inc. |
2,645
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | SA | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
ASSMANN WSW Components |
24,224
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOCKET PLCC 44POS TIN SMD
|
Tube | - | Surface Mount | PLCC | Closed Frame | Solder | Polyamide (PA9T)，Nylon 9T，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||
|
|
|
On Shore Technology Inc. |
7,780
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | SA | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Gold | 80μin (2.03μm) | Brass | ||
|
|
|
On Shore Technology Inc. |
6,028
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | SA | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
ASSMANN WSW Components |
8,465
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
16,495
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
21,261
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | - | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||
|
|
|
3M |
6,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Tape & Reel (TR) | 8400 | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 32 (2 x 7，2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
3M |
6,697
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Cut Tape (CT) | 8400 | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 32 (2 x 7，2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
3M |
6,697
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
- | 8400 | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 32 (2 x 7，2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
3M |
1,440
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tape & Reel (TR) | 8400 | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
3M |
1,583
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Cut Tape (CT) | 8400 | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
3M |
1,583
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
- | 8400 | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
ASSMANN WSW Components |
11,029
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 68POS TIN
|
Tube | - | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 68 (4 x 17) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
7,338
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
3M |
3,289
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | 8400 | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
ASSMANN WSW Components |
8,981
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
Tube | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Amphenol FCI |
8,538
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | - | Through Hole | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||
|
|
|
CnC Tech |
15,341
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze |
