Packaging:
Termination:
Number of Positions or Pins (Grid):
Pitch - Mating:
Contact Finish - Mating:
Contact Finish Thickness - Mating:
Contact Material - Mating:
Contact Finish - Post:
Contact Finish Thickness - Post:
Découvrez les produits 4
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Features Termination Housing Material Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post
475939000
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET LGA 1366POS NICKEL
- Closed Frame Solder - 1366 (32 x 41) - Nickel 3μin (0.08μm) - - Nickel 3μin (0.08μm)
475940001
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET LGA 1366POS GOLD
Tray Open Frame Solder Liquid Crystal Polymer (LCP) 1366 (32 x 41) 0.040" (1.02mm) Gold 15μin (0.38μm) Copper Alloy 0.040" (1.01mm) - -
475940002
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET LGA 1366POS GOLD
Tray Open Frame Solder Liquid Crystal Polymer (LCP) 1366 (32 x 41) 0.040" (1.02mm) Gold 30μin (0.76μm) Copper Alloy 0.040" (1.01mm) - -
475943001
Molex,LLC
Enquête
-
-
MOQ: 1  MPQ: 1
CONN SOCKET LGA 1356POS GOLD
Tray Open Frame - - 1356 (32 x 41) 0.040" (1.02mm) Gold 15μin (0.38μm) - - - -