- Packaging：
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- Series：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Number of Positions or Pins (Grid)：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 137
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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TE Connectivity AMP Connectors |
386
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | 14 (2 x 7) | Gold | 25μin (0.63μm) | Beryllium Copper | - | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
9,620
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | 8 (2 x 4) | Gold | 25μin (0.63μm) | Copper Alloy | - | - | - | ||
|
|
|
TE Connectivity AMP Connectors |
1,530
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | 28 (2 x 14) | Gold | 5μin (0.127μm) | Copper Alloy | - | - | - | ||
|
|
|
TE Connectivity AMP Connectors |
1,060
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | 16 (2 x 8) | Gold | 25μin (0.63μm) | Copper Alloy | - | - | - | ||
|
|
|
TE Connectivity AMP Connectors |
1,597
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | 16 (2 x 8) | Gold | 25μin (0.63μm) | Beryllium Copper | - | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
996
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | 36 (2 x 18) | Gold | 25μin (0.63μm) | Copper Alloy | - | - | - | ||
|
|
|
TE Connectivity AMP Connectors |
196
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | 48 (2 x 24) | Gold | 25μin (0.63μm) | Copper Alloy | - | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
85
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | 28 (2 x 14) | Gold | 25μin (0.63μm) | Copper Alloy | Tin-Lead | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
73
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | 18 (2 x 9) | Gold | 25μin (0.63μm) | Copper Alloy | Tin-Lead | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
96
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | 20 (2 x 10) | Gold | 25μin (0.63μm) | Copper Alloy | Tin-Lead | - | Copper Alloy | ||
|
|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | 14 (2 x 7) | Gold | 25μin (0.63μm) | Copper Alloy | Tin-Lead | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN-LEAD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | 8 (2 x 4) | Tin-Lead | - | Copper Alloy | - | - | - | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | 18 (2 x 9) | Gold | 25μin (0.63μm) | Copper Alloy | Tin-Lead | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | 32 (2 x 16) | Gold | 5μin (0.127μm) | Copper Alloy | Tin-Lead | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | 14 (2 x 7) | Gold | 25μin (0.63μm) | Copper Alloy | - | - | - | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | 24 (2 x 12) | Gold | 25μin (0.63μm) | Copper Alloy | Tin-Lead | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | 20 (2 x 10) | Gold | Flash | Copper Alloy | Gold | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | 8 (2 x 4) | Gold | 25μin (0.63μm) | Copper Alloy | Gold | 5μin (0.13μm) | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | 40 (2 x 20) | Gold | 5μin (0.127μm) | Copper Alloy | Tin-Lead | - | Copper Alloy | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | 48 (2 x 24) | Gold | 25μin (0.63μm) | Copper Alloy | Tin-Lead | - | Copper Alloy |
