Douilles pour circuits intégrés, transistors - Zui Ai Technology（Taiwan）Company.

Packaging：

Series：

Operating Temperature：

Type：

Features：

Housing Material：

Number of Positions or Pins (Grid)：

1 (1 x 1) (8)
10 (1 x 10) (13)
10 (2 x 5) (50)
11 (1 x 11) (12)
12 (1 x 12) (13)
12 (2 x 6) (18)
13 (1 x 13) (12)
132 (14 x 14) (2)
14 (1 x 14) (13)
14 (2 x 7) (62)
15 (1 x 15) (12)
16 (1 x 16) (13)
16 (2 x 8) (71)
17 (1 x 17) (12)
18 (1 x 18) (13)
18 (2 x 9) (58)
19 (1 x 19) (12)
2 (1 x 2) (16)
20 (1 x 20) (15)
20 (2 x 10) (77)
21 (1 x 21) (12)
22 (1 x 22) (12)
22 (2 x 11) (69)
23 (1 x 23) (12)
24 (1 x 24) (12)
24 (2 x 12) (123)
25 (1 x 25) (12)
26 (1 x 26) (8)
26 (2 x 13) (8)
27 (1 x 27) (8)
28 (1 x 28) (8)
28 (2 x 14) (115)
29 (1 x 29) (7)
3 (1 x 3) (12)
30 (1 x 30) (8)
30 (2 x 15) (22)
31 (1 x 31) (8)
32 (1 x 32) (12)
32 (2 x 16) (79)
33 (1 x 33) (8)
34 (1 x 34) (8)
34 (2 x 17) (12)
35 (1 x 35) (8)
36 (1 x 36) (8)
36 (2 x 18) (35)
37 (1 x 37) (8)
38 (1 x 38) (8)
38 (2 x 19) (12)
39 (1 x 39) (8)
4 (1 x 4) (13)
4 (2 x 2) (18)
40 (1 x 40) (8)
40 (2 x 20) (72)
42 (2 x 21) (21)
44 (2 x 22) (4)
48 (2 x 24) (34)
5 (1 x 5) (13)
50 (2 x 25) (31)
52 (2 x 26) (24)
56 (2 x 28) (1)
6 (1 x 6) (13)
6 (2 x 3) (36)
60 (2 x 30) (4)
64 (1 x 64) (2)
64 (2 x 32) (22)
68 (11 x 11) (2)
68 (2 x 34) (2)
7 (1 x 7) (13)
8 (1 x 8) (13)
8 (2 x 4) (55)
9 (1 x 9) (13)

Pitch - Mating：

Contact Finish - Mating：

Contact Finish Thickness - Mating：

Contact Material - Mating：

Pitch - Post：

Contact Finish - Post：

Contact Finish Thickness - Post：

Contact Material - Post：

Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Type	Features	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Type	Features	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
	AR 08 HZW/TN	ASSMANN WSW Components	1,598	3 jours	-	CONN IC DIP SOCKET 8POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS GOLD	Tube	-	-40°C ~ 105°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Thermoplastic，Polyester	8 (2 x 4)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	AR 14 HZW/TN	ASSMANN WSW Components	1,211	3 jours	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	Tube	-	-40°C ~ 105°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Thermoplastic，Polyester	14 (2 x 7)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	123-93-314-41-001000	Mill-Max Manufacturing Corp.	1,215	3 jours	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	Tube	123	-55°C ~ 125°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	14 (2 x 7)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	AR 16 HZW/TN	ASSMANN WSW Components	671	3 jours	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	Tube	-	-40°C ~ 105°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Thermoplastic，Polyester	16 (2 x 8)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	123-93-316-41-001000	Mill-Max Manufacturing Corp.	434	3 jours	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	Tube	123	-55°C ~ 125°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	16 (2 x 8)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	AR 20-HZW/TN	ASSMANN WSW Components	2,011	3 jours	-	CONN IC DIP SOCKET 20POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS GOLD	Tube	-	-40°C ~ 105°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Thermoplastic，Polyester	20 (2 x 10)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	123-93-318-41-001000	Mill-Max Manufacturing Corp.	632	3 jours	-	CONN IC DIP SOCKET 18POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 18POS GOLD	Tube	123	-55°C ~ 125°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	18 (2 x 9)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	D01-9952042	Harwin Inc.	122	3 jours	-	CONN SOCKET SIP 20POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SIP 20POS GOLD	Bulk	D01-995	-55°C ~ 125°C	SIP	-	Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled	20 (1 x 20)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Beryllium Copper	0.100" (2.54mm)	Tin	196.8μin (5.00μm)	Brass
	D01-9953242	Harwin Inc.	515	3 jours	-	CONN SOCKET SIP 32POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SIP 32POS GOLD	Bulk	D01-995	-55°C ~ 125°C	SIP	-	Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled	32 (1 x 32)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Beryllium Copper	0.100" (2.54mm)	Tin	196.8μin (5.00μm)	Brass
	AR 40 HZW/TN	ASSMANN WSW Components	338	3 jours	-	CONN IC DIP SOCKET 40POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 40POS GOLD	Tube	-	-40°C ~ 105°C	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Thermoplastic，Polyester	40 (2 x 20)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	123-43-640-41-001000	Mill-Max Manufacturing Corp.	464	3 jours	-	CONN IC DIP SOCKET 40POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 40POS GOLD	Tube	123	-55°C ~ 125°C	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	40 (2 x 20)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Brass Alloy
	25-0503-30	Aries Electronics	555	3 jours	-	CONN SOCKET SIP 25POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SIP 25POS GOLD	Bulk	503	-	SIP	-	Polyamide (PA)，Nylon，Glass Filled	25 (1 x 25)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Brass
	XR2A-0802	Omron Electronics Inc-EMC Div	163	3 jours	-	CONN IC DIP SOCKET 8POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS GOLD	Bulk	XR2	-55°C ~ 125°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Polybutylene Terephthalate (PBT)，Glass Filled	8 (2 x 4)	0.100" (2.54mm)	Gold	29.5μin (0.75μm)	Beryllium Copper	0.100" (2.54mm)	Gold	29.5μin (0.75μm)	Beryllium Copper
	123-43-314-41-001000	Mill-Max Manufacturing Corp.	189	3 jours	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	Tube	123	-55°C ~ 125°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	14 (2 x 7)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Brass Alloy
	123-43-316-41-001000	Mill-Max Manufacturing Corp.	287	3 jours	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	Tube	123	-55°C ~ 125°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	16 (2 x 8)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Brass Alloy
	123-93-320-41-001000	Mill-Max Manufacturing Corp.	188	3 jours	-	CONN IC DIP SOCKET 20POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS GOLD	Tube	123	-55°C ~ 125°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	20 (2 x 10)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	123-13-314-41-001000	Mill-Max Manufacturing Corp.	228	3 jours	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	Tube	123	-55°C ~ 125°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	14 (2 x 7)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	10μin (0.25μm)	Brass Alloy
	AR 24 HZW/TN	ASSMANN WSW Components	89	3 jours	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	Tube	-	-40°C ~ 105°C	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Thermoplastic，Polyester	24 (2 x 12)	0.100" (2.54mm)	Gold	-	Beryllium Copper	0.100" (2.54mm)	Tin	200μin (5.08μm)	Beryllium Copper
	123-93-324-41-001000	Mill-Max Manufacturing Corp.	293	3 jours	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	Tube	123	-55°C ~ 125°C	DIP，0.3" (7.62mm) Row Spacing	Open Frame	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	24 (2 x 12)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy
	123-93-624-41-001000	Mill-Max Manufacturing Corp.	210	3 jours	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	Tube	123	-55°C ~ 125°C	DIP，0.6" (15.24mm) Row Spacing	Open Frame	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	24 (2 x 12)	0.100" (2.54mm)	Gold	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Tin-Lead	200μin (5.08μm)	Brass Alloy

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