- Mounting Type：
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- Type：
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- Termination：
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- Number of Positions or Pins (Grid)：
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- Contact Finish Thickness - Mating：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 51
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Omron Electronics Inc-EMC Div |
163
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3 jours |
-
|
MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Wire Wrap | 8 (2 x 4) | Gold | 29.5μin (0.75μm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | ||
|
|
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Omron Electronics Inc-EMC Div |
249
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | 24 (2 x 12) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Beryllium Copper | ||
|
|
|
Omron Electronics Inc-EMC Div |
434
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 16 (2 x 8) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Beryllium Copper | ||
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|
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Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 14 (2 x 7) | Gold | 29.5μin (0.75μm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | ||
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|
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Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC SOCKET 20POS
|
- | Housing | Closed Frame | Solder | 20 (1 x 20) | - | - | - | - | Beryllium Copper | ||
|
|
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Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC SOCKET 32POS
|
Through Hole | Housing | Closed Frame | Wire Wrap | 32 (1 x 32) | - | - | - | - | Beryllium Copper | ||
|
|
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Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 3POS GOLD
|
Through Hole | SIP | Closed Frame | Solder | 3 (1 x 3) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Beryllium Copper | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Beryllium Copper | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Threaded | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
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Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Threaded | SIP | - | Solder | 10 (1 x 10) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | Gold | Flash | Gold | Flash | Beryllium Copper | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 16POS GOLD
|
Through Hole | SIP | Closed Frame | Solder | 16 (1 x 16) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Beryllium Copper | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 14 (2 x 7) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Beryllium Copper | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 15POS GOLD
|
Through Hole | SIP | Closed Frame | Solder | 15 (1 x 15) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Beryllium Copper | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
|
Through Hole | SIP | Closed Frame | Solder | 20 (1 x 20) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Beryllium Copper | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 15POS GOLD
|
Through Hole | SIP | Closed Frame | Solder | 15 (1 x 15) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Beryllium Copper | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 18 (2 x 9) | Gold | 30μin (0.76μm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN ZIG-ZAG 16POS GOLD
|
Through Hole | Zig-Zag | Closed Frame | Solder | 16 (2 x 8) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Beryllium Copper | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
|
Threaded | SIP | - | Solder | 10 (1 x 10) | Gold | 10μin (0.25μm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 14 (2 x 7) | Gold | Flash | Gold | Flash | Beryllium Copper |
