- Fabricant:
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- Series:
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- Operating Temperature:
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- Mounting Type:
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- Type:
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- Termination:
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- Housing Material:
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- Number of Positions or Pins (Grid):
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- Pitch - Mating:
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- Contact Finish - Mating:
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- Contact Finish Thickness - Mating:
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- Contact Material - Mating:
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- Pitch - Post:
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- Contact Finish - Post:
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- Contact Finish Thickness - Post:
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- Conditions sélectionnées:
Découvrez les produits 3,291
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
ASSMANN WSW Components |
24,224
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOCKET PLCC 44POS TIN SMD
|
Tube | - | -40°C ~ 105°C | Surface Mount | PLCC | Solder | Polyamide (PA9T),Nylon 9T,Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
ASSMANN WSW Components |
21,261
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | PLCC | Solder | Polybutylene Terephthalate (PBT) | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
3M |
6,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Tape & Reel (TR) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 32 (2 x 7,2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
3M |
6,697
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Cut Tape (CT) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 32 (2 x 7,2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
3M |
6,697
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
- | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 32 (2 x 7,2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
Mill-Max Manufacturing Corp. |
2,842
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | 940 | -55°C ~ 125°C | Surface Mount | PLCC | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.050" (1.27mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||||
Mill-Max Manufacturing Corp. |
2,567
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | 940 | -55°C ~ 125°C | Through Hole | PLCC | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 44 (4 x 11) | 0.100" (2.54mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||||
3M |
1,440
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tape & Reel (TR) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
3M |
1,583
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Cut Tape (CT) | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
3M |
1,583
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
- | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
ASSMANN WSW Components |
11,029
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 68POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | PLCC | Solder | Polybutylene Terephthalate (PBT) | 68 (4 x 17) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
Mill-Max Manufacturing Corp. |
4,745
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 52POS TIN
|
Tube | 940 | -55°C ~ 125°C | Through Hole | PLCC | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 52 (4 x 13) | 0.100" (2.54mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||||
Mill-Max Manufacturing Corp. |
5,288
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 210 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||||
3M |
3,289
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | 8400 | -40°C ~ 105°C | Surface Mount | PLCC | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||||
Mill-Max Manufacturing Corp. |
1,065
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 4POS GOLD
|
Tube | 917 | -55°C ~ 125°C | Through Hole | Transistor,TO-5 | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 4 (Round) | - | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass Alloy | ||||
Mill-Max Manufacturing Corp. |
4,274
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Tube | 540 | -55°C ~ 125°C | Surface Mount | PLCC | Solder | Polyphenylene Sulfide (PPS) | 32 (2 x 7,2 x 9) | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Copper Alloy | ||||
Mill-Max Manufacturing Corp. |
1,840
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 84POS TIN
|
Tube | 940 | -55°C ~ 125°C | Through Hole | PLCC | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 84 (4 x 21) | 0.100" (2.54mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||||
Amphenol FCI |
8,538
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | PLCC | Solder | Polyphenylene Sulfide (PPS) | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||||
Aries Electronics |
3,517
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile,513 | - | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | 210 | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy |