Number of Positions or Pins (Grid):
Découvrez les produits 3,291
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Series Operating Temperature Mounting Type Type Termination Housing Material Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post
A-CCS 044-Z-SM
ASSMANN WSW Components
24,224
3 jours
-
MOQ: 1  MPQ: 1
IC SOCKET PLCC 44POS TIN SMD
Tube - -40°C ~ 105°C Surface Mount PLCC Solder Polyamide (PA9T),Nylon 9T,Glass Filled 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Phosphor Bronze 0.050" (1.27mm) Tin 160μin (4.06μm) Phosphor Bronze
A-CCS-044-Z-T
ASSMANN WSW Components
21,261
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Tube - -40°C ~ 105°C Through Hole PLCC Solder Polybutylene Terephthalate (PBT) 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Phosphor Bronze 0.100" (2.54mm) Tin 160μin (4.06μm) Phosphor Bronze
8432-21B1-RK-TR
3M
6,300
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 32POS TIN
Tape & Reel (TR) 8400 -40°C ~ 105°C Surface Mount PLCC Solder Polybutylene Terephthalate (PBT),Glass Filled 32 (2 x 7,2 x 9) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
8432-21B1-RK-TR
3M
6,697
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 32POS TIN
Cut Tape (CT) 8400 -40°C ~ 105°C Surface Mount PLCC Solder Polybutylene Terephthalate (PBT),Glass Filled 32 (2 x 7,2 x 9) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
8432-21B1-RK-TR
3M
6,697
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 32POS TIN
- 8400 -40°C ~ 105°C Surface Mount PLCC Solder Polybutylene Terephthalate (PBT),Glass Filled 32 (2 x 7,2 x 9) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
940-44-044-17-400000
Mill-Max Manufacturing Corp.
2,842
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Tube 940 -55°C ~ 125°C Surface Mount PLCC Solder Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 44 (4 x 11) 0.050" (1.27mm) Tin 150μin (3.81μm) Beryllium Copper 0.050" (1.27mm) Tin 200μin (5.08μm) Brass Alloy
940-44-044-24-000000
Mill-Max Manufacturing Corp.
2,567
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Tube 940 -55°C ~ 125°C Through Hole PLCC Solder Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 44 (4 x 11) 0.100" (2.54mm) Tin 150μin (3.81μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass Alloy
8444-21B1-RK-TR
3M
1,440
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Tape & Reel (TR) 8400 -40°C ~ 105°C Surface Mount PLCC Solder Polybutylene Terephthalate (PBT),Glass Filled 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
8444-21B1-RK-TR
3M
1,583
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Cut Tape (CT) 8400 -40°C ~ 105°C Surface Mount PLCC Solder Polybutylene Terephthalate (PBT),Glass Filled 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
8444-21B1-RK-TR
3M
1,583
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
- 8400 -40°C ~ 105°C Surface Mount PLCC Solder Polybutylene Terephthalate (PBT),Glass Filled 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
A-CCS 068-Z-T
ASSMANN WSW Components
11,029
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 68POS TIN
Tube - -40°C ~ 105°C Through Hole PLCC Solder Polybutylene Terephthalate (PBT) 68 (4 x 17) 0.050" (1.27mm) Tin 160μin (4.06μm) Phosphor Bronze 0.100" (2.54mm) Tin 160μin (4.06μm) Phosphor Bronze
940-44-052-24-000000
Mill-Max Manufacturing Corp.
4,745
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 52POS TIN
Tube 940 -55°C ~ 125°C Through Hole PLCC Solder Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 52 (4 x 13) 0.100" (2.54mm) Tin 150μin (3.81μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass Alloy
210-43-316-41-001000
Mill-Max Manufacturing Corp.
5,288
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 16POS GOLD
Tube 210 -55°C ~ 125°C Through Hole DIP,0.3" (7.62mm) Row Spacing Solder Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 16 (2 x 8) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass Alloy
8444-21B1-RK-TP
3M
3,289
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Tube 8400 -40°C ~ 105°C Surface Mount PLCC Solder Polybutylene Terephthalate (PBT),Glass Filled 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
917-43-104-41-005000
Mill-Max Manufacturing Corp.
1,065
3 jours
-
MOQ: 1  MPQ: 1
CONN TRANSIST TO-5 4POS GOLD
Tube 917 -55°C ~ 125°C Through Hole Transistor,TO-5 Solder Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 4 (Round) - Gold 30μin (0.76μm) Beryllium Copper - Tin 200μin (5.08μm) Brass Alloy
540-44-032-17-400000
Mill-Max Manufacturing Corp.
4,274
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 32POS TIN
Tube 540 -55°C ~ 125°C Surface Mount PLCC Solder Polyphenylene Sulfide (PPS) 32 (2 x 7,2 x 9) 0.050" (1.27mm) Tin 150μin (3.81μm) Copper Alloy 0.050" (1.27mm) Tin 150μin (3.81μm) Copper Alloy
940-44-084-24-000000
Mill-Max Manufacturing Corp.
1,840
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 84POS TIN
Tube 940 -55°C ~ 125°C Through Hole PLCC Solder Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 84 (4 x 21) 0.100" (2.54mm) Tin 150μin (3.81μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass Alloy
54020-44030LF
Amphenol FCI
8,538
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Tube - -40°C ~ 105°C Through Hole PLCC Solder Polyphenylene Sulfide (PPS) 44 (4 x 11) 0.050" (1.27mm) Tin 100μin (2.54μm) Copper Alloy 0.050" (1.27mm) Tin 100μin (2.54μm) Copper Alloy
10-3513-10
Aries Electronics
3,517
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 10POS GOLD
Bulk Lo-PROfile,513 - Through Hole DIP,0.3" (7.62mm) Row Spacing Solder Polyamide (PA46),Nylon 4/6,Glass Filled 10 (2 x 5) 0.100" (2.54mm) Gold 10μin (0.25μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass
210-43-628-41-001000
Mill-Max Manufacturing Corp.
Enquête
-
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 28POS GOLD
Tube 210 -55°C ~ 125°C Through Hole DIP,0.6" (15.24mm) Row Spacing Solder Polycyclohexylenedimethylene Terephthalate (PCT),Polyester 28 (2 x 14) 0.100" (2.54mm) Gold 30μin (0.76μm) Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Brass Alloy