- Operating Temperature：
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- Mounting Type：
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- Features：
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- Termination：
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- Housing Material：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 23
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Aries Electronics |
1,290
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
743
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
346 | -55°C ~ 125°C | Through Hole | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
346 | -55°C ~ 125°C | Through Hole | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
714 | -55°C ~ 125°C | Through Hole | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS TIN
|
511 | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 50μin (1.27μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
518 | - | Surface Mount | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
508 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6 | Gold | 10μin (0.25μm) | Beryllium Copper | - | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
508 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6 | Gold | 10μin (0.25μm) | Beryllium Copper | - | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS TIN
|
700 Elevator Strip-Line | -55°C ~ 105°C | Through Hole | Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS TIN
|
700 Elevator Strip-Line | -55°C ~ 105°C | Through Hole | Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS TIN
|
700 Elevator Strip-Line | -55°C ~ 105°C | Through Hole | Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS TIN
|
501 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS TIN
|
501 | -55°C ~ 105°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
501 | -55°C ~ 125°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
501 | -55°C ~ 125°C | Through Hole | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Phosphor Bronze |
