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- Series：
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- Housing Material：
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- Contact Finish - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Conditions sélectionnées:
Découvrez les produits 448
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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ASSMANN WSW Components |
48,059
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
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|
|
3M |
8,449
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyester，Glass Filled | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||
|
|
|
On Shore Technology Inc. |
6,028
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | SA | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester，Glass Filled | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
ASSMANN WSW Components |
16,495
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Mill-Max Manufacturing Corp. |
20,612
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
6,589
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
5,288
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 210 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
7,762
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass Alloy | ||
|
|
|
3M |
1,089
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 16POS GLD
|
Bulk | Textool | -55°C ~ 125°C | Connector | DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing | Closed Frame | Press-Fit | Polysulfone (PSU)，Glass Filled | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
337
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 16POS GOLD
|
Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | - | Gold | - | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
On Shore Technology Inc. |
3,583
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | ED | -55°C ~ 110°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
|
|
|
CnC Tech |
6,405
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
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|
|
ASSMANN WSW Components |
16,375
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
Amphenol FCI |
22,435
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA)，Nylon | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||
|
|
|
3M |
5,074
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyester，Glass Filled | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||
|
|
|
CnC Tech |
2,840
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
On Shore Technology Inc. |
3,539
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | SA | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester，Glass Filled | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Gold | 80μin (2.03μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
3,065
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TINLEAD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
2,676
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,057
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 210 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy |
