- Operating Temperature：
-
- Termination：
-
- Housing Material：
-
- Contact Finish Thickness - Mating：
-
- Contact Material - Mating：
-
- Contact Finish - Post：
-
- Contact Finish Thickness - Post：
-
- Contact Material - Post：
-
- Conditions sélectionnées:
Découvrez les produits 10
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Samtec Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 114POS GOLD
|
MVAS | - | Solder | - | Gold | 30μin (0.76μm) | - | Gold | 30μin (0.76μm) | - | ||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 114POS GOLD
|
510 | -55°C ~ 125°C | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 114POS GOLD
|
510 | -55°C ~ 125°C | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 114POS GOLD
|
510 | -55°C ~ 125°C | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 114POS GOLD
|
510 | -55°C ~ 125°C | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | 29.5μin (0.75μm) | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 114POS GOLD
|
510 | -55°C ~ 125°C | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | 29.5μin (0.75μm) | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 114POS GOLD
|
510 | -55°C ~ 125°C | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | 29.5μin (0.75μm) | Beryllium Copper | Tin | - | Brass | |||
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA 114POS GOLD
|
- | - | Press-Fit | Thermoplastic，Polyester，Glass Filled | Gold | 30μin (0.76μm) | Beryllium Copper | Tin-Lead | 118.1μin (3.00μm) | Phosphor Bronze | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PGA SOLDER TAIL
|
550 | -55°C ~ 125°C | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Tin | - | Beryllium Copper | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
PGA SOLDER TAIL
|
550 | -55°C ~ 125°C | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Gold | 10μin (0.25μm) | Brass |
