Douilles pour circuits intégrés, transistors - Zui Ai Technology（Taiwan）Company.

Series：

Operating Temperature：

Mounting Type：

Type：

Features：

Termination：

Number of Positions or Pins (Grid)：

1 (1 x 1) (4)
10 (1 x 10) (4)
10 (2 x 5) (21)
11 (1 x 11) (4)
12 (1 x 12) (4)
12 (2 x 6) (10)
13 (1 x 13) (4)
14 (1 x 14) (4)
14 (2 x 7) (26)
15 (1 x 15) (4)
16 (1 x 16) (4)
16 (2 x 8) (23)
17 (1 x 17) (4)
18 (1 x 18) (4)
18 (2 x 9) (25)
19 (1 x 19) (4)
2 (1 x 2) (8)
20 (1 x 20) (4)
20 (2 x 10) (23)
21 (1 x 21) (4)
22 (1 x 22) (4)
22 (2 x 11) (6)
23 (1 x 23) (4)
24 (1 x 24) (4)
24 (2 x 12) (6)
25 (1 x 25) (4)
26 (1 x 26) (4)
26 (2 x 13) (6)
27 (1 x 27) (4)
28 (1 x 28) (4)
28 (2 x 14) (6)
29 (1 x 29) (3)
3 (1 x 3) (4)
30 (1 x 30) (4)
30 (2 x 15) (6)
31 (1 x 31) (4)
32 (1 x 32) (4)
32 (2 x 16) (6)
33 (1 x 33) (4)
34 (1 x 34) (4)
34 (2 x 17) (6)
35 (1 x 35) (4)
36 (1 x 36) (4)
36 (2 x 18) (6)
37 (1 x 37) (4)
38 (1 x 38) (4)
38 (2 x 19) (6)
39 (1 x 39) (4)
4 (1 x 4) (4)
4 (2 x 2) (4)
40 (1 x 40) (4)
40 (2 x 20) (8)
42 (2 x 21) (1)
48 (2 x 24) (2)
5 (1 x 5) (4)
56 (2 x 28) (1)
6 (1 x 6) (4)
6 (2 x 3) (4)
7 (1 x 7) (4)
8 (1 x 8) (4)
8 (2 x 4) (27)
9 (1 x 9) (4)

Pitch - Mating：

Contact Finish - Mating：

Contact Finish Thickness - Mating：

Contact Material - Mating：

Pitch - Post：

Contact Finish - Post：

Contact Finish Thickness - Post：

Contact Material - Post：

Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post
	14-810-90	Aries Electronics	104	3 jours	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Vertical	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	14 (2 x 7)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	10-2820-90T	Aries Electronics	268	3 jours	-	CONN IC DIP SOCKET 10POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 10POS TIN	Vertisockets 800	-	Through Hole，Right Angle，Horizontal	DIP，0.2" (5.08mm) Row Spacing	Closed Frame	Solder	10 (2 x 5)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze
	10-2810-90T	Aries Electronics	4,093	3 jours	-	CONN IC DIP SOCKET 10POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 10POS TIN	Vertisockets 800	-	Through Hole，Right Angle，Vertical	DIP，0.2" (5.08mm) Row Spacing	Closed Frame	Solder	10 (2 x 5)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze
	14-820-90T	Aries Electronics	1,020	3 jours	-	CONN IC DIP SOCKET 14POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS TIN	Vertisockets 800	-	Through Hole，Right Angle，Horizontal	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	14 (2 x 7)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze
	16-823-90	Aries Electronics	127	3 jours	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Horizontal	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	16 (2 x 8)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	10-2810-90	Aries Electronics	1,234	3 jours	-	CONN IC DIP SOCKET 10POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 10POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Vertical	DIP，0.2" (5.08mm) Row Spacing	Closed Frame	Solder	10 (2 x 5)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	18-6810-90T	Aries Electronics	929	3 jours	-	CONN IC DIP SOCKET 18POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 18POS TIN	Vertisockets 800	-	Through Hole，Right Angle，Vertical	DIP，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	18 (2 x 9)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze
	18-6823-90	Aries Electronics	111	3 jours	-	CONN IC DIP SOCKET 18POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 18POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Horizontal	DIP，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	18 (2 x 9)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	08-823-90	Aries Electronics	75	3 jours	-	CONN IC DIP SOCKET 8POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Horizontal	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	8 (2 x 4)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	08-810-90	Aries Electronics	35	3 jours	-	CONN IC DIP SOCKET 8POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Vertical	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	8 (2 x 4)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	10-2822-90	Aries Electronics	27	3 jours	-	CONN IC DIP SOCKET 10POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 10POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Horizontal	DIP，0.2" (5.08mm) Row Spacing	Closed Frame	Solder	10 (2 x 5)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	40-6823-90	Aries Electronics	44	3 jours	-	CONN IC DIP SOCKET 40POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 40POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Horizontal	DIP，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	40 (2 x 20)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	14-810-90R	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 14POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS TIN	Vertisockets 800	-	Through Hole，Right Angle，Vertical	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	14 (2 x 7)	0.100" (2.54mm)	Tin	50μin (1.27μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	50μin (1.27μm)	Phosphor Bronze
	20-823-90	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 20POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Horizontal	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	20 (2 x 10)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	14-823-90	Aries Electronics	25	3 jours	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Horizontal	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	14 (2 x 7)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	14-810-90T	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 14POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS TIN	Vertisockets 800	-	Through Hole，Right Angle，Vertical	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	14 (2 x 7)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze
	28-6823-90	Aries Electronics	15	3 jours	-	CONN IC DIP SOCKET 28POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Horizontal	DIP，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	28 (2 x 14)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	16-810-90T	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 16POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS TIN	Vertisockets 800	-	Through Hole，Right Angle，Vertical	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	16 (2 x 8)	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze	0.100" (2.54mm)	Tin	200μin (5.08μm)	Phosphor Bronze
	08-6810-90	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 8POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 8POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Vertical	DIP，0.6" (15.24mm) Row Spacing	Closed Frame	Solder	8 (2 x 4)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze
	14-820-90	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	Vertisockets 800	-	Through Hole，Right Angle，Horizontal	DIP，0.3" (7.62mm) Row Spacing	Closed Frame	Solder	14 (2 x 7)	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze	0.100" (2.54mm)	Gold	10μin (0.25μm)	Phosphor Bronze

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