- Operating Temperature:
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- Mounting Type:
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- Type:
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- Features:
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- Termination:
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- Housing Material:
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- Number of Positions or Pins (Grid):
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- Pitch - Mating:
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- Contact Material - Mating:
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- Pitch - Post:
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- Contact Finish - Post:
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- Contact Finish Thickness - Post:
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- Contact Material - Post:
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- Conditions sélectionnées:
Découvrez les produits 101
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
Molex,LLC |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET LGA 2011POS GOLD
|
Tray | 105142 | - | Surface Mount | LGA | Open Frame | Solder | Thermoplastic | 2011 (47 x 58) | 0.040" (1.02mm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | Diplomate DL | -55°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | Diplomate DL | -55°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 20 (2 x 10) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 370POS GOLD
|
Tray | - | - | Through Hole | PGA,ZIF (ZIP) | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 370 (19 x 19) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 321POS GOLD
|
Tray | - | - | Through Hole | PGA,ZIF (ZIP) | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 321 (19 x 19) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic,Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic,Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 6 (2 x 3) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 18 (2 x 9) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 20 (2 x 10) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 20 (2 x 10) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | Diplomate DL | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Thermoplastic,Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze |