- Operating Temperature：
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- Mounting Type：
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- Features：
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- Termination：
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- Housing Material：
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- Pitch - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 10
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
203
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
|
117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
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|
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On Shore Technology Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 68POS
|
ED | -55°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 0.050" (1.27mm) | - | - | Phosphor Bronze | 0.050" (1.27mm) | - | - | Phosphor Bronze | ||
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|
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On Shore Technology Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 68POS TIN
|
ED | -55°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
Mill-Max Manufacturing Corp. |
6
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
|
117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
|
117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.070" (1.78mm) | Gold | Flash | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
|
117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.070" (1.78mm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
|
117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.070" (1.78mm) | Gold | Flash | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
|
|
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
|
117 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester，Glass Filled | 0.070" (1.78mm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | - | Brass | |||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
|
127 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 68POS GOLD
|
127 | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy |
