- Series：
-
- Operating Temperature：
-
- Mounting Type：
-
- Features：
-
- Housing Material：
-
- Number of Positions or Pins (Grid)：
-
- Pitch - Mating：
-
- Contact Finish Thickness - Mating：
-
- Contact Material - Mating：
-
- Pitch - Post：
-
- Contact Finish Thickness - Post：
-
- Conditions sélectionnées:
Découvrez les produits 19
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | |
|
|
|
TE Connectivity AMP Connectors |
378
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 4POS GOLD
|
8058 | -55°C ~ 125°C | Panel Mount | Transistor，TO-5 | - | Polytetrafluoroethylene (PTFE) | 4 (Round) | - | Gold | - | Beryllium Copper | - | Gold | - | ||
|
|
|
TE Connectivity AMP Connectors |
434
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 8POS GOLD
|
8058 | -55°C ~ 125°C | Panel Mount | Transistor，TO-5 | - | Polytetrafluoroethylene (PTFE) | 8 (Round) | - | Gold | - | Beryllium Copper | - | Gold | - | ||
|
|
|
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 32POS TIN
|
D01-993 | -55°C ~ 125°C | Through Hole | SIP | - | Polyamide (PA46)，Nylon 4/6，Glass Filled | 32 (1 x 32) | 0.100" (2.54mm) | Tin | - | Brass | 0.100" (2.54mm) | Tin | - | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 42POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 44POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 44 (2 x 22) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 42POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 44POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 44 (2 x 22) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
6556 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polyphenylene Sulfide (PPS)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) |
