- Operating Temperature：
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- Mounting Type：
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- Features：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 278
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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|
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3M |
149
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 121POS GOLD
|
Bulk | Textool | -55°C ~ 150°C | Through Hole | - | Solder | Polyethersulfone (PES) | 121 (11 x 11) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
180
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | - | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
3M |
110
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 225POS GOLD
|
Bulk | Textool | -55°C ~ 150°C | - | - | - | Polyethersulfone (PES) | 225 (15 x 15) | 0.100" (2.54mm) | - | - | - | 0.100" (2.54mm) | - | - | - | ||
|
|
|
3M |
140
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 169POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | - | Solder | Polyethersulfone (PES) | 169 (13 x 13) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
96
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | - | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
19
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | - | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
15
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | - | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
3M |
83
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 100POS GOLD
|
Bulk | Textool | -55°C ~ 150°C | Through Hole | - | Solder | Polyethersulfone (PES) | 100 (10 x 10) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
95
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 289POS GOLD
|
Bulk | Textool | -55°C ~ 150°C | Through Hole | - | Solder | Polyethersulfone (PES) | 289 (17 x 17) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
64
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 361POS GOLD
|
Bulk | Textool | -55°C ~ 150°C | Through Hole | - | Solder | Polyethersulfone (PES) | 361 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
25
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 441POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | - | Solder | Polyethersulfone (PES) | 441 (21 x 21) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
21
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | - | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
3M |
21
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 625POS GOLD
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Bulk | Textool | -55°C ~ 150°C | Through Hole | - | Solder | Polyethersulfone (PES) | 625 (25 x 25) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
3
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | - | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PLS | -65°C ~ 125°C | Through Hole | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | - | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 370POS GOLD
|
Tray | - | - | Through Hole | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 370 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 370POS GOLD
|
Tray | - | - | Through Hole | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 370 (19 x 19) | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 321POS GOLD
|
Tray | - | - | Through Hole | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 321POS GOLD
|
Tray | - | - | Through Hole | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 321POS GOLD
|
Tray | - | - | Through Hole | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze |
