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- Number of Positions or Pins (Grid)：
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- Conditions sélectionnées:
Découvrez les produits 33
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
91
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 64POS GOLD
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Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
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Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 4 (2 x 2) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 6POS GOLD
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Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 6 (2 x 3) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
99
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3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
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Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 10 (2 x 5) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 12POS GOLD
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Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 12 (2 x 6) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 18 (2 x 9) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 20 (2 x 10) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 22POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 22 (2 x 11) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 24 (2 x 12) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 26POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 26 (2 x 13) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (2 x 14) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 30POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 30 (2 x 15) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 32 (2 x 16) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 34POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 34 (2 x 17) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 36POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 36 (2 x 18) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 38POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 38 (2 x 19) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
|
|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 40 (2 x 20) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy |
