- Series：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Features：
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- Termination：
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- Housing Material：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 344
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Aries Electronics |
3,517
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
660
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
On Shore Technology Inc. |
3,296
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Tube | SA | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester，Glass Filled | Gold | Flash | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
308
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Tube | 299 | -55°C ~ 125°C | Through Hole，Right Angle，Horizontal | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
369
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Tube | 299 | -55°C ~ 125°C | Through Hole，Right Angle，Horizontal | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
205
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Tube | 299 | -55°C ~ 125°C | Through Hole，Right Angle，Horizontal | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
472
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
1,148
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
184
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Tube | 299 | -55°C ~ 125°C | Through Hole，Right Angle，Horizontal | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
268
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS TIN
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Horizontal | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | Tin | 200μin (5.08μm) | Phosphor Bronze | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
588
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | -55°C ~ 105°C | Through Hole，Right Angle，Horizontal | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
1,326
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | -55°C ~ 105°C | Through Hole，Right Angle，Horizontal | DIP，0.4" (10.16mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
4,093
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS TIN
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | Tin | 200μin (5.08μm) | Phosphor Bronze | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
1,234
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Vertical | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | Gold | 10μin (0.25μm) | Phosphor Bronze | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Mill-Max Manufacturing Corp. |
960
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Tube | 299 | -55°C ~ 125°C | Through Hole，Right Angle，Horizontal | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
170
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Tube | 111 | -55°C ~ 125°C | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
65
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Tube | 299 | -55°C ~ 125°C | Through Hole，Right Angle，Horizontal | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
27
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | - | Through Hole，Right Angle，Horizontal | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6 | Gold | 10μin (0.25μm) | Phosphor Bronze | Gold | 10μin (0.25μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | -55°C ~ 105°C | Through Hole，Right Angle，Horizontal | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass |
