- Operating Temperature：
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- Mounting Type：
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- Features：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 12
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Aries Electronics |
Enquête
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-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS TIN
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Bulk | -55°C ~ 105°C | Through Hole | SIP | Elevated | Polyamide (PA46)，Nylon 4/6，Glass Filled | 20 (1 x 20) | Tin | 200μin (5.08μm) | Phosphor Bronze | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 20POS GOLD
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- | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 20 (2 x 10) | Gold | 20μin (0.51μm) | Beryllium Copper | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS GOLD
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- | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 8 (2 x 4) | Gold | 20μin (0.51μm) | Beryllium Copper | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS GOLD
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- | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 8 (2 x 4) | Gold | 20μin (0.51μm) | Beryllium Copper | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS GOLD
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- | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 16 (2 x 8) | Gold | 20μin (0.51μm) | Beryllium Copper | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 6POS GOLD
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- | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 6 (2 x 3) | Gold | 20μin (0.51μm) | Beryllium Copper | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 20POS GOLD
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- | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 20 (2 x 10) | Gold | 20μin (0.51μm) | Beryllium Copper | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 24POS GOLD
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- | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Aluminum Alloy | 24 (2 x 12) | Gold | 20μin (0.51μm) | Beryllium Copper | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 28POS GOLD
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- | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Aluminum Alloy | 28 (2 x 14) | Gold | 20μin (0.51μm) | Beryllium Copper | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 32POS GOLD
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- | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Aluminum Alloy | 32 (2 x 16) | Gold | 20μin (0.51μm) | Beryllium Copper | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 40POS GOLD
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- | -55°C ~ 125°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Aluminum Alloy | 40 (2 x 20) | Gold | 20μin (0.51μm) | Beryllium Copper | Gold | 20μin (0.51μm) | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 18POS GOLD
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- | -55°C ~ 125°C | Through Hole，Right Angle，Vertical | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Aluminum Alloy | 18 (2 x 9) | Gold | 20μin (0.51μm) | Beryllium Copper | Gold | 20μin (0.51μm) | Beryllium Copper |
