- Series：
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- Operating Temperature：
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- Type：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 858
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|
|
|
ASSMANN WSW Components |
24,224
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOCKET PLCC 44POS TIN SMD
|
Tube | - | -40°C ~ 105°C | PLCC | Closed Frame | Solder | Polyamide (PA9T)，Nylon 9T，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||
|
|
|
Molex，LLC |
96,800
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 32POS GOLD
|
Tape & Reel (TR) | 105028 | - | Camera Socket | Open Frame | Solder | Thermoplastic | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Nickel | 50μin (1.27μm) | Copper Alloy | ||
|
|
|
Molex，LLC |
97,189
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 32POS GOLD
|
Cut Tape (CT) | 105028 | - | Camera Socket | Open Frame | Solder | Thermoplastic | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Nickel | 50μin (1.27μm) | Copper Alloy | ||
|
|
|
Molex，LLC |
97,189
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 32POS GOLD
|
- | 105028 | - | Camera Socket | Open Frame | Solder | Thermoplastic | 32 (4 x 8) | 0.035" (0.90mm) | Gold | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Nickel | 50μin (1.27μm) | Copper Alloy | ||
|
|
|
3M |
6,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Tape & Reel (TR) | 8400 | -40°C ~ 105°C | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 32 (2 x 7，2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
3M |
6,697
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Cut Tape (CT) | 8400 | -40°C ~ 105°C | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 32 (2 x 7，2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
3M |
6,697
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
- | 8400 | -40°C ~ 105°C | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 32 (2 x 7，2 x 9) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
2,842
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | 940 | -55°C ~ 125°C | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.050" (1.27mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
3M |
1,440
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tape & Reel (TR) | 8400 | -40°C ~ 105°C | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
3M |
1,583
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Cut Tape (CT) | 8400 | -40°C ~ 105°C | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
3M |
1,583
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
- | 8400 | -40°C ~ 105°C | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
Aries Electronics |
6,009
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Bulk | 518 | - | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
3M |
3,289
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | 8400 | -40°C ~ 105°C | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Copper Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
4,274
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Tube | 540 | -55°C ~ 125°C | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 32 (2 x 7，2 x 9) | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Copper Alloy | ||
|
|
|
CnC Tech |
5,739
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | - | -55°C ~ 105°C | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
2,051
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 20POS TIN
|
Tube | - | -40°C ~ 105°C | PLCC | Closed Frame | Solder | Polyamide (PA9T)，Nylon 9T，Glass Filled | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||
|
|
|
Mill-Max Manufacturing Corp. |
4,396
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN-LEAD
|
Tube | 214 | -55°C ~ 125°C | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Tin-Lead | 100μin (2.54μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
ASSMANN WSW Components |
9,135
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC PLCC SOCKET 32POS TIN SMD
|
Tube | - | -40°C ~ 105°C | PLCC | Closed Frame | Solder | Polyamide (PA9T)，Nylon 9T，Glass Filled | 32 (4 x 8) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,197
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 20POS TIN
|
Tube | 940 | -55°C ~ 125°C | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 20 (4 x 5) | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.050" (1.27mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
2,577
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 28POS TIN
|
Tube | 940 | -55°C ~ 125°C | PLCC | Closed Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 28 (4 x 7) | 0.050" (1.27mm) | Tin | 150μin (3.81μm) | Beryllium Copper | 0.050" (1.27mm) | Tin | 200μin (5.08μm) | Brass Alloy |
