- Series：
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- Operating Temperature：
-
- Mounting Type：
-
- Features：
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- Termination：
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- Housing Material：
-
- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 47
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 2011POS GOLD
|
Tray | 105142 | - | Surface Mount | Open Frame | Solder | Thermoplastic | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 2011POS GOLD
|
Tray | 105142 | - | Surface Mount | Open Frame | Solder | Thermoplastic | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS NICKEL
|
- | 47594 | - | Surface Mount | Closed Frame | Solder | - | 1366 (32 x 41) | - | Nickel | 3μin (0.08μm) | - | - | Nickel | 3μin (0.08μm) | - | ||
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS GOLD
|
Tray | 47594 | - | Surface Mount | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS GOLD
|
Tray | 47594 | - | Surface Mount | Open Frame | Solder | Liquid Crystal Polymer (LCP) | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||
|
|
|
Molex，LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1356POS GOLD
|
Tray | 47594 | - | Surface Mount | Open Frame | - | - | 1356 (32 x 41) | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | - | - | - | - | - | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1567POS GOLD
|
Tray | - | - | Surface Mount | Open Frame | Solder | Thermoplastic | 1567 | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.039" (1.00mm) | - | - | Copper Alloy | ||
|
|
TE Connectivity AMP Connectors |
256
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 2011POS GOLD
|
Bulk | - | - | Surface Mount | Open Frame | Solder | Thermoplastic | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.035" (0.90mm) | Gold | 15μin (0.38μm) | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
683
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 3647POS GOLD
|
Tray | - | - | Surface Mount | Open Frame | Solder | Thermoplastic | 3647 | - | Gold | 30μin (0.76μm) | Copper Alloy | - | - | - | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
682
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 3647POS GOLD
|
Tray | - | - | Surface Mount | Open Frame | Solder | Thermoplastic | 3647 | - | Gold | 30μin (0.76μm) | Copper Alloy | - | - | - | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
101
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1366POS GOLD
|
Tray | - | - | Surface Mount | Open Frame | Solder | Thermoplastic | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.040" (1.01mm) | - | - | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
110
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 2011POS GOLD
|
Tray | - | -25°C ~ 100°C | Surface Mount | Open Frame | Solder | Thermoplastic | 2011 (47 x 58) | - | Gold | 15μin (0.38μm) | Copper Alloy | - | Gold | 15μin (0.38μm) | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 2011POS GOLD
|
Bulk | - | - | Surface Mount | Open Frame | Solder | Thermoplastic | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.035" (0.90mm) | Gold | 30μin (0.76μm) | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
144
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 3647POS GOLD
|
Tray | - | - | Surface Mount | Open Frame | Solder | Thermoplastic | 3647 | - | Gold | 30μin (0.76μm) | Copper Alloy | - | - | - | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
171
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1150POS GOLD
|
Bulk | - | - | Surface Mount | Open Frame | Solder | Thermoplastic | 1150 | 0.036" (0.91mm) | Gold | 3.9μin (0.10μm) | Copper Alloy | 0.036" (0.91mm) | - | - | - | |||
|
|
TE Connectivity AMP Connectors |
298
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1150POS GOLD
|
Bulk | - | - | Surface Mount | Closed Frame | Solder | Thermoplastic | 1150 | 0.036" (0.91mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.036" (0.91mm) | - | - | - | |||
|
|
TE Connectivity AMP Connectors |
291
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 2011POS GOLD
|
Bulk | - | - | Surface Mount | Closed Frame | Solder | Thermoplastic | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.035" (0.90mm) | Gold | 15μin (0.38μm) | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
52
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 3647POS GOLD
|
Tray | - | - | Surface Mount | Open Frame | Solder | Thermoplastic | 3647 | 0.039" (1.00mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.034" (0.86mm) | Gold | 30μin (0.76μm) | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
96
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 3647POS GOLD
|
Tray | - | - | Surface Mount | Open Frame | Solder | Thermoplastic | 3647 | - | Gold | 30μin (0.76μm) | Copper Alloy | - | - | - | Copper Alloy | |||
|
|
TE Connectivity AMP Connectors |
57
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 3647POS GOLD
|
Tray | - | - | Surface Mount | Open Frame | Solder | Thermoplastic | 3647 | 0.039" (1.00mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.034" (0.86mm) | Gold | 30μin (0.76μm) | Copper Alloy |
