- Packaging:
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- Series:
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- Operating Temperature:
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- Mounting Type:
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- Features:
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- Termination:
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- Housing Material:
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- Pitch - Mating:
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- Contact Finish - Mating:
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- Contact Finish Thickness - Mating:
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- Contact Material - Mating:
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- Pitch - Post:
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- Contact Finish - Post:
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- Contact Finish Thickness - Post:
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- Contact Material - Post:
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- Conditions sélectionnées:
Découvrez les produits 16,946
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
Aries Electronics |
180
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | PGA,ZIF (ZIP) | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
Aries Electronics |
96
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | PGA,ZIF (ZIP) | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
Aries Electronics |
19
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | PGA,ZIF (ZIP) | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
Aries Electronics |
15
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | PGA,ZIF (ZIP) | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
Aries Electronics |
21
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | PGA,ZIF (ZIP) | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
Aries Electronics |
80
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | PGA | - | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
27
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA GOLD
|
Bulk | PGM | -55°C ~ 105°C | Through Hole | PGA | - | Solder | Polyamide (PA46),Nylon 4/6,Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||||
Aries Electronics |
3
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | PGA,ZIF (ZIP) | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PLS | -65°C ~ 125°C | Through Hole | PGA,ZIF (ZIP) | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
Keystone Electronics |
62
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
COVER PWR TRANS .210"ID TO-3
|
Bulk | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||||
Aries Electronics |
30
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF GOLD
|
Bulk | PRS | -65°C ~ 125°C | Through Hole | PGA,ZIF (ZIP) | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
ASSMANN WSW Components |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOCKET 2 CONTACTS SINGLE ROW
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||||
ASSMANN WSW Components |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOCKET 3 CONTACTS SINGLE ROW
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||||
ASSMANN WSW Components |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOCKET 4 CONTACTS SINGLE ROW
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||||
ASSMANN WSW Components |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOCKET 5 CONTACTS SINGLE ROW
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||||
ASSMANN WSW Components |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOCKET 6 CONTACTS SINGLE ROW
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||||
ASSMANN WSW Components |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOCKET 7 CONTACTS SINGLE ROW
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||||
ASSMANN WSW Components |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOCKET 8 CONTACTS SINGLE ROW
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||||
ASSMANN WSW Components |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOCKET 9 CONTACTS SINGLE ROW
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||||
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC SKT DBL
|
- | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |