- Operating Temperature:
-
- Termination:
-
- Housing Material:
-
- Contact Finish Thickness - Mating:
-
- Contact Material - Mating:
-
- Pitch - Post:
-
- Contact Finish Thickness - Post:
-
- Contact Material - Post:
-
- Conditions sélectionnées:
Découvrez les produits 3
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Termination | Housing Material | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Termination | Housing Material | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
Molex,LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1356POS GOLD
|
47594 | - | - | - | 15μin (0.38μm) | - | - | - | - | - | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1356POS GOLD
|
- | -25°C ~ 100°C | Solder | Thermoplastic | 30μin (0.76μm) | Copper Alloy | 0.040" (1.01mm) | Gold | 30μin (0.76μm) | Copper Alloy | ||||
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET LGA 1356POS GOLD
|
- | -25°C ~ 100°C | Solder | Thermoplastic | 15μin (0.38μm) | Copper Alloy | 0.040" (1.01mm) | Gold | 15μin (0.38μm) | Copper Alloy |