Douilles pour circuits intégrés, transistors - Zui Ai Technology（Taiwan）Company.

Packaging：

Series：

Operating Temperature：

Mounting Type：

Type：

Features：

Termination：

Housing Material：

Number of Positions or Pins (Grid)：

1 (1 x 1) (3)
10 (1 x 10) (4)
10 (2 x 5) (1)
10 (2 x 5)，6 Loaded (1)
10 (2 x 5)，8 Loaded (1)
100 (10 x 10) (1)
11 (1 x 11) (2)
114 (13 x 13) (1)
12 (1 x 12) (1)
12 (2 x 6) (1)
121 (11 x 11) (1)
13 (1 x 13) (2)
1356 (32 x 41) (1)
14 (1 x 14) (1)
14 (2 x 7) (6)
14 (2 x 7)，4 Loaded (3)
14 (2 x 7)，8 Loaded (3)
15 (1 x 15) (1)
16 (1 x 16) (1)
16 (2 x 8) (11)
16 (2 x 8)，4 Loaded (1)
16 (2 x 8)，8 Loaded (4)
168 (17 x 17) (1)
169 (13 x 13) (1)
17 (1 x 17) (1)
18 (1 x 18) (1)
18 (2 x 9) (5)
19 (1 x 19) (1)
2 (1 x 2) (1)
20 (1 x 20) (6)
20 (2 x 10) (9)
2011 (47 x 58) (3)
21 (1 x 21) (1)
22 (1 x 22) (1)
22 (2 x 11) (2)
23 (1 x 23) (1)
24 (1 x 24) (2)
24 (2 x 12) (12)
25 (1 x 25) (1)
26 (1 x 26) (1)
26 (2 x 13) (1)
27 (1 x 27) (1)
28 (1 x 28) (1)
28 (2 x 14) (17)
28 (2 x 14)，14 Loaded (1)
28 (2 x 14)，16 Loaded (1)
289 (17 x 17) (1)
29 (1 x 29) (1)
3 (1 x 3) (1)
3 (Oval) (3)
3 (Rectangular) (5)
30 (1 x 30) (1)
30 (2 x 15) (1)
31 (1 x 31) (1)
32 (1 x 32) (4)
32 (2 x 16) (10)
321 (19 x 19) (10)
33 (1 x 33) (1)
34 (1 x 34) (2)
34 (2 x 17) (4)
35 (1 x 17，1 x 18) (4)
35 (1 x 35) (1)
36 (1 x 36) (2)
36 (2 x 18) (1)
361 (19 x 19) (1)
3647 (2)
37 (1 x 37) (1)
370 (19 x 19) (7)
38 (1 x 38) (1)
38 (2 x 19) (1)
39 (1 x 19，1 x 20) (2)
39 (1 x 39) (1)
4 (1 x 4) (1)
4 (2 x 2) (2)
40 (1 x 40) (1)
40 (2 x 20) (12)
41 (1 x 41) (1)
42 (1 x 42) (1)
42 (2 x 21) (4)
43 (1 x 43) (1)
44 (1 x 44) (1)
44 (2 x 22) (1)
441 (21 x 21) (1)
45 (1 x 45) (1)
46 (1 x 46) (1)
46 (2 x 23) (1)
47 (1 x 47) (1)
478 (26 x 26) (1)
479 (26 x 26) (3)
48 (1 x 48) (1)
48 (2 x 24) (2)
49 (1 x 49) (1)
5 (1 x 5) (1)
5 (Rectangular) (3)
50 (1 x 50) (1)
50 (2 x 25) (1)
51 (1 x 25，1 x 26) (4)
51 (1 x 51) (1)
52 (1 x 52) (1)
52 (2 x 26) (1)
53 (1 x 53) (1)
54 (1 x 54) (1)
54 (2 x 27) (1)
55 (1 x 55) (1)
56 (1 x 56) (1)
56 (2 x 28) (2)
57 (1 x 57) (1)
58 (1 x 58) (1)
58 (2 x 29) (1)
59 (1 x 59) (1)
6 (1 x 6) (1)
6 (2 x 3) (3)
60 (1 x 60) (1)
60 (2 x 30) (1)
61 (1 x 61) (1)
62 (1 x 62) (1)
62 (2 x 31) (1)
625 (25 x 25) (1)
63 (1 x 63) (1)
64 (1 x 64) (1)
64 (2 x 32) (3)
68 (4 x 17) (4)
7 (1 x 7) (1)
8 (1 x 8) (2)
8 (2 x 4) (6)
8 (2 x 4)，4 Loaded (1)
9 (1 x 9) (1)
90 (2 x 45) (1)

Pitch - Mating：

Contact Finish Thickness - Mating：

Contact Material - Mating：

Pitch - Post：

Contact Finish - Post：

Contact Material - Post：

Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Material - Post
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Series	Operating Temperature	Mounting Type	Type	Features	Termination	Housing Material	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Pitch - Post	Contact Finish - Post	Contact Material - Post
	TDU03DTON	Sullins Connector Solutions	829	3 jours	-	CONN SOCKET TRANSIST 3POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET TRANSIST 3POS GOLD	Bulk	-	-55°C ~ 175°C	Through Hole	Transistor	Board Guide	Solder	Polyphenylene Sulfide (PPS)	3 (Rectangular)	-	30μin (0.76μm)	Beryllium Copper	-	Gold	Beryllium Copper
	214-3339-00-0602J	3M	1,022	3 jours	-	CONN IC DIP SOCKET ZIF 14POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 14POS GLD	Bulk	Textool	-55°C ~ 125°C	Connector	DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing	Closed Frame	Press-Fit	Polysulfone (PSU)，Glass Filled	14 (2 x 7)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	216-3340-00-0602J	3M	1,089	3 jours	-	CONN IC DIP SOCKET ZIF 16POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 16POS GLD	Bulk	Textool	-55°C ~ 125°C	Connector	DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing	Closed Frame	Press-Fit	Polysulfone (PSU)，Glass Filled	16 (2 x 8)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	228-1277-00-0602J	3M	112	3 jours	-	CONN IC DIP SOCKET ZIF 28POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 28POS GLD	Bulk	Textool	-55°C ~ 125°C	Connector	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Press-Fit	Polysulfone (PSU)，Glass Filled	28 (2 x 14)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	240-1280-00-0602J	3M	688	3 jours	-	CONN IC DIP SOCKET ZIF 40POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 40POS GLD	Bulk	Textool	-55°C ~ 125°C	Connector	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Press-Fit	Polysulfone (PSU)，Glass Filled	40 (2 x 20)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	208-7391-55-1902	3M	683	3 jours	-	CONN SOCKET SOIC 8POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SOIC 8POS GOLD	Bulk	Textool	-55°C ~ 150°C	Through Hole	SOIC	Closed Frame	Solder	Polyethersulfone (PES)，Glass Filled	8 (2 x 4)	-	30μin (0.76μm)	Beryllium Copper	-	Gold	Beryllium Copper
	248-1282-00-0602J	3M	1,515	3 jours	-	CONN IC DIP SOCKET ZIF 48POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 48POS GLD	Tube	Textool	-55°C ~ 125°C	Connector	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Press-Fit	Polysulfone (PSU)，Glass Filled	48 (2 x 24)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	216-7224-55-1902	3M	337	3 jours	-	CONN SOCKET SOIC 16POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SOIC 16POS GOLD	Bulk	Textool	-55°C ~ 150°C	Through Hole	SOIC	Closed Frame	Solder	Polyethersulfone (PES)，Glass Filled	16 (2 x 8)	-	-	Beryllium Copper	-	Gold	Beryllium Copper
	232-1287-00-0602J	3M	193	3 jours	-	CONN IC DIP SOCKET ZIF 32POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 32POS GLD	Bulk	Textool	-55°C ~ 125°C	Connector	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Press-Fit	Polysulfone (PSU)，Glass Filled	32 (2 x 16)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	210-2599-00-0602	3M	150	3 jours	-	CONN SOCKET SIP ZIF 10POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SIP ZIF 10POS GOLD	Bulk	Textool	-55°C ~ 125°C	Through Hole	SIP，ZIF (ZIP)	-	Solder	Polysulfone (PSU)，Glass Filled	10 (1 x 10)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	240-1288-00-0602J	3M	249	3 jours	-	CONN IC DIP SOCKET ZIF 40POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 40POS GLD	Bulk	Textool	-55°C ~ 125°C	Connector	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Press-Fit	Polysulfone (PSU)，Glass Filled	40 (2 x 20)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	220-2600-00-0602	3M	179	3 jours	-	CONN SOCKET SIP ZIF 20POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SIP ZIF 20POS GOLD	Bulk	Textool	-55°C ~ 125°C	Through Hole	SIP，ZIF (ZIP)	-	Solder	Polysulfone (PSU)，Glass Filled	20 (1 x 20)	0.100" (2.54mm)	-	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	224-5809-00-0602	3M	138	3 jours	-	CONN SOCKET SIP ZIF 24POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SIP ZIF 24POS GOLD	Bulk	Textool	-55°C ~ 125°C	Through Hole	SIP，ZIF (ZIP)	-	Solder	Polysulfone (PSU)，Glass Filled	24 (1 x 24)	0.100" (2.54mm)	-	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	200-6311-9UN-1900	3M	149	3 jours	-	CONN SOCKET PGA ZIF 121POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET PGA ZIF 121POS GOLD	Bulk	Textool	-55°C ~ 150°C	Through Hole	PGA，ZIF (ZIP)	-	Solder	Polyethersulfone (PES)	121 (11 x 11)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	110-43-210-10-002000	Mill-Max Manufacturing Corp.	998	3 jours	-	CONN IC DIP SOCKET 10POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 10POS GOLD	Tube	110	-55°C ~ 125°C	Through Hole	DIP，0.2" (5.08mm) Row Spacing	Open Frame	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	10 (2 x 5)，8 Loaded	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Brass Alloy
	714-43-164-31-018000	Mill-Max Manufacturing Corp.	202	3 jours	-	CONN SOCKET SIP 64POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET SIP 64POS GOLD	Bulk	714	-55°C ~ 125°C	Through Hole	SIP	-	Solder	Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester	64 (1 x 64)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Brass Alloy
	TDU03DTOD	Sullins Connector Solutions	144	3 jours	-	CONN SOCKET TRANSIST 3POS GOLD MOQ: 1 MPQ: 1	CONN SOCKET TRANSIST 3POS GOLD	Bulk	-	-55°C ~ 175°C	Through Hole	Transistor	Board Guide，Flange	Solder	Polyphenylene Sulfide (PPS)	3 (Rectangular)	-	30μin (0.76μm)	Beryllium Copper	-	Gold	Beryllium Copper
	TCC05DCSN-S1403	Sullins Connector Solutions	103	3 jours	-	CONN TRANSIST TO-220/TO-247 5POS MOQ: 1 MPQ: 1	CONN TRANSIST TO-220/TO-247 5POS	Bulk	-	-65°C ~ 175°C	Through Hole	Transistor，TO-220 and TO-247	-	Solder	Polyphenylene Sulfide (PPS)	5 (Rectangular)	-	30μin (0.76μm)	Beryllium Copper	-	Gold	Beryllium Copper
	232-1285-00-0602J	3M	134	3 jours	-	CONN IC DIP SOCKET ZIF 32POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 32POS GLD	Bulk	Textool	-55°C ~ 125°C	Connector	DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing	Closed Frame	Press-Fit	Polysulfone (PSU)，Glass Filled	32 (2 x 16)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper
	218-3341-00-0602J	3M	157	3 jours	-	CONN IC DIP SOCKET ZIF 18POS GLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET ZIF 18POS GLD	Bulk	Textool	-55°C ~ 125°C	Connector	DIP，ZIF (ZIP)，0.3" (7.62mm) Row Spacing	Closed Frame	Press-Fit	Polysulfone (PSU)，Glass Filled	18 (2 x 9)	0.100" (2.54mm)	30μin (0.76μm)	Beryllium Copper	0.100" (2.54mm)	Gold	Beryllium Copper

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