- Series：
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- Operating Temperature：
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- Type：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 171
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Material - Post | |
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|
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TE Connectivity AMP Connectors |
3,026
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | 500 | -55°C ~ 125°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 6 (2 x 3) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Gold | Nickel | ||
|
|
|
On Shore Technology Inc. |
2,015
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | 78.7μin (2.00μm) | Beryllium Copper | 0.100" (2.54mm) | Copper | Brass | ||
|
|
|
On Shore Technology Inc. |
2,681
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 6 (2 x 3) | 0.100" (2.54mm) | 78.7μin (2.00μm) | Beryllium Copper | 0.100" (2.54mm) | Copper | Brass | ||
|
|
|
On Shore Technology Inc. |
1,712
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | 78.7μin (2.00μm) | Beryllium Copper | 0.100" (2.54mm) | Copper | Brass | ||
|
|
|
On Shore Technology Inc. |
121
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | 78.7μin (2.00μm) | Beryllium Copper | 0.100" (2.54mm) | Copper | Brass | ||
|
|
|
On Shore Technology Inc. |
721
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 20 (2 x 10) | 0.100" (2.54mm) | 78.7μin (2.00μm) | Beryllium Copper | 0.100" (2.54mm) | Copper | Brass | ||
|
|
|
On Shore Technology Inc. |
187
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | 78.7μin (2.00μm) | Beryllium Copper | 0.100" (2.54mm) | Copper | Brass | ||
|
|
|
On Shore Technology Inc. |
43
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | 78.7μin (2.00μm) | Beryllium Copper | 0.100" (2.54mm) | Copper | Brass | ||
|
|
|
On Shore Technology Inc. |
32
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 18 (2 x 9) | 0.100" (2.54mm) | 78.7μin (2.00μm) | Beryllium Copper | 0.100" (2.54mm) | Copper | Brass | ||
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|
|
Molex，LLC |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 24POS GOLD
|
Tape & Reel (TR) | 47337 | -55°C ~ 85°C | Surface Mount | Camera Socket | Open Frame | Polyamide (PA)，Nylon | 24 (4 x 6) | 0.035" (0.90mm) | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Gold | Copper Alloy | ||
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|
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Molex，LLC |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 24POS GOLD
|
Cut Tape (CT) | 47337 | -55°C ~ 85°C | Surface Mount | Camera Socket | Open Frame | Polyamide (PA)，Nylon | 24 (4 x 6) | 0.035" (0.90mm) | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Gold | Copper Alloy | ||
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|
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Molex，LLC |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN CAM SOCKET 24POS GOLD
|
- | 47337 | -55°C ~ 85°C | Surface Mount | Camera Socket | Open Frame | Polyamide (PA)，Nylon | 24 (4 x 6) | 0.035" (0.90mm) | 12μin (0.30μm) | Copper Alloy | 0.035" (0.90mm) | Gold | Copper Alloy | ||
|
|
|
On Shore Technology Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 22POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.4" (10.16mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 22 (2 x 11) | 0.100" (2.54mm) | 78.7μin (2.00μm) | Beryllium Copper | 0.100" (2.54mm) | Copper | Brass | ||
|
|
|
On Shore Technology Inc. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | 78.7μin (2.00μm) | Beryllium Copper | 0.100" (2.54mm) | Copper | Brass | ||
|
|
|
On Shore Technology Inc. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS GOLD
|
Tube | BU-178HT | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Polybutylene Terephthalate (PBT)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | 78.7μin (2.00μm) | Beryllium Copper | 0.100" (2.54mm) | Copper | Brass | ||
|
|
TE Connectivity AMP Connectors |
8,966
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Gold | Copper | |||
|
|
TE Connectivity AMP Connectors |
2,415
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Gold | Copper | |||
|
|
TE Connectivity AMP Connectors |
2,601
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Gold | Copper | |||
|
|
TE Connectivity AMP Connectors |
2,259
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 18 (2 x 9) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Gold | Copper | |||
|
|
TE Connectivity AMP Connectors |
4,052
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 20 (2 x 10) | 0.100" (2.54mm) | Flash | Beryllium Copper | 0.100" (2.54mm) | Gold | Copper |
