- Operating Temperature:
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- Mounting Type:
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- Type:
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- Features:
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- Termination:
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- Housing Material:
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- Number of Positions or Pins (Grid):
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- Pitch - Mating:
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- Contact Finish - Mating:
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- Contact Finish Thickness - Mating:
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- Contact Material - Mating:
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- Pitch - Post:
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- Contact Finish - Post:
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- Contact Finish Thickness - Post:
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- Contact Material - Post:
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- Conditions sélectionnées:
Découvrez les produits 17,296
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
ASSMANN WSW Components |
108,884
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
81,814
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
48,059
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
36,980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
45,190
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
ASSMANN WSW Components |
47,594
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic,Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
ASSMANN WSW Components |
24,224
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SOCKET PLCC 44POS TIN SMD
|
Tube | -40°C ~ 105°C | Surface Mount | PLCC | Closed Frame | Solder | Polyamide (PA9T),Nylon 9T,Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
ASSMANN WSW Components |
8,465
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic,Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
ASSMANN WSW Components |
16,495
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic,Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
ASSMANN WSW Components |
21,261
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
ASSMANN WSW Components |
11,029
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 68POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT) | 68 (4 x 17) | 0.050" (1.27mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 160μin (4.06μm) | Phosphor Bronze | ||||
ASSMANN WSW Components |
7,338
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic,Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
ASSMANN WSW Components |
8,981
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic,Polyester | 40 (2 x 20) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||||
Amphenol FCI |
8,538
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 44 (4 x 11) | 0.050" (1.27mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.050" (1.27mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||||
Sullins Connector Solutions |
829
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET TRANSIST 3POS GOLD
|
Bulk | -55°C ~ 175°C | Through Hole | Transistor | Board Guide | Solder | Polyphenylene Sulfide (PPS) | 3 (Rectangular) | - | Gold | 30μin (0.76μm) | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||||
ASSMANN WSW Components |
31,632
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | -55°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||||
Amphenol FCI |
25,910
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | -55°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA),Nylon | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||||
CnC Tech |
15,341
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||||
CnC Tech |
8,646
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | -40°C ~ 105°C | Through Hole,Kinked Pin | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||||
CnC Tech |
6,405
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | -40°C ~ 105°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze |