Number of Positions or Pins (Grid):
Découvrez les produits 17,296
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Operating Temperature Mounting Type Type Features Termination Housing Material Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post
A 08-LC-TT
ASSMANN WSW Components
108,884
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 8POS TIN
Tube -55°C ~ 85°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Polybutylene Terephthalate (PBT) 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze 0.100" (2.54mm) Tin - Phosphor Bronze
A 14-LC-TT
ASSMANN WSW Components
81,814
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 14POS TIN
Tube -55°C ~ 85°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Polybutylene Terephthalate (PBT) 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze 0.100" (2.54mm) Tin - Phosphor Bronze
A 16-LC-TT
ASSMANN WSW Components
48,059
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 16POS TIN
Tube -55°C ~ 85°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Polybutylene Terephthalate (PBT) 16 (2 x 8) 0.100" (2.54mm) Tin - Phosphor Bronze 0.100" (2.54mm) Tin - Phosphor Bronze
A 18-LC-TT
ASSMANN WSW Components
36,980
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 18POS TIN
Tube -55°C ~ 85°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Polybutylene Terephthalate (PBT) 18 (2 x 9) 0.100" (2.54mm) Tin - Phosphor Bronze 0.100" (2.54mm) Tin - Phosphor Bronze
A 20-LC-TT
ASSMANN WSW Components
45,190
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 20POS TIN
Tube -55°C ~ 85°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Polybutylene Terephthalate (PBT) 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze 0.100" (2.54mm) Tin - Phosphor Bronze
AR 08 HZL-TT
ASSMANN WSW Components
47,594
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 8POS TIN
Tube -40°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Thermoplastic,Polyester 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Beryllium Copper
A-CCS 044-Z-SM
ASSMANN WSW Components
24,224
3 jours
-
MOQ: 1  MPQ: 1
IC SOCKET PLCC 44POS TIN SMD
Tube -40°C ~ 105°C Surface Mount PLCC Closed Frame Solder Polyamide (PA9T),Nylon 9T,Glass Filled 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Phosphor Bronze 0.050" (1.27mm) Tin 160μin (4.06μm) Phosphor Bronze
AR 14 HZL-TT
ASSMANN WSW Components
8,465
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 14POS TIN
Tube -40°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Thermoplastic,Polyester 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Beryllium Copper
AR 16 HZL-TT
ASSMANN WSW Components
16,495
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 16POS TIN
Tube -40°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Thermoplastic,Polyester 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Beryllium Copper
A-CCS-044-Z-T
ASSMANN WSW Components
21,261
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Tube -40°C ~ 105°C Through Hole PLCC Closed Frame Solder Polybutylene Terephthalate (PBT) 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Phosphor Bronze 0.100" (2.54mm) Tin 160μin (4.06μm) Phosphor Bronze
A-CCS 068-Z-T
ASSMANN WSW Components
11,029
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 68POS TIN
Tube -40°C ~ 105°C Through Hole PLCC Closed Frame Solder Polybutylene Terephthalate (PBT) 68 (4 x 17) 0.050" (1.27mm) Tin 160μin (4.06μm) Phosphor Bronze 0.100" (2.54mm) Tin 160μin (4.06μm) Phosphor Bronze
AR 28 HZL-TT
ASSMANN WSW Components
7,338
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 28POS TIN
Tube -40°C ~ 105°C Through Hole DIP,0.6" (15.24mm) Row Spacing Open Frame Solder Thermoplastic,Polyester 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Beryllium Copper
AR 40 HZL-TT
ASSMANN WSW Components
8,981
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 40POS TIN
Tube -40°C ~ 105°C Through Hole DIP,0.6" (15.24mm) Row Spacing Open Frame Solder Thermoplastic,Polyester 40 (2 x 20) 0.100" (2.54mm) Tin - Beryllium Copper 0.100" (2.54mm) Tin 200μin (5.08μm) Beryllium Copper
54020-44030LF
Amphenol FCI
8,538
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Tube -40°C ~ 105°C Through Hole PLCC Closed Frame Solder Polyphenylene Sulfide (PPS) 44 (4 x 11) 0.050" (1.27mm) Tin 100μin (2.54μm) Copper Alloy 0.050" (1.27mm) Tin 100μin (2.54μm) Copper Alloy
TDU03DTON
Sullins Connector Solutions
829
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET TRANSIST 3POS GOLD
Bulk -55°C ~ 175°C Through Hole Transistor Board Guide Solder Polyphenylene Sulfide (PPS) 3 (Rectangular) - Gold 30μin (0.76μm) Beryllium Copper - Gold 30μin (0.76μm) Beryllium Copper
A 08-LC-TR
ASSMANN WSW Components
31,632
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 8POS TIN
Tube -55°C ~ 85°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Polybutylene Terephthalate (PBT) 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze 0.100" (2.54mm) Tin - Phosphor Bronze
DILB8P-223TLF
Amphenol FCI
25,910
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 8POS TIN
Tube -55°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Polyamide (PA),Nylon 8 (2 x 4) 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy 0.100" (2.54mm) Tin 100μin (2.54μm) Copper Alloy
243-08-1-03
CnC Tech
15,341
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 8POS TIN
Tube -40°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Polybutylene Terephthalate (PBT),Glass Filled 8 (2 x 4) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
245-08-1-03
CnC Tech
8,646
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 8POS TIN
Tube -40°C ~ 105°C Through Hole,Kinked Pin DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Polybutylene Terephthalate (PBT),Glass Filled 8 (2 x 4) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
243-16-1-03
CnC Tech
6,405
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 16POS TIN
Tube -40°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder Polybutylene Terephthalate (PBT),Glass Filled 16 (2 x 8) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze