- Packaging：
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- Series：
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- Operating Temperature：
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- Features：
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- Termination：
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- Housing Material：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 126
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Aries Electronics |
2,219
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS TIN
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Bulk | 511 | -55°C ~ 105°C | Through Hole | SIP | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | ||
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3M |
179
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP ZIF 20POS GOLD
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Bulk | Textool | -55°C ~ 125°C | Through Hole | SIP，ZIF (ZIP) | - | Solder | Polysulfone (PSU)，Glass Filled | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
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|
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Harwin Inc. |
1,558
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS GOLD
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Bulk | D01-997 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||
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Harwin Inc. |
122
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS GOLD
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Bulk | D01-995 | -55°C ~ 125°C | Through Hole | SIP | - | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||
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Aries Electronics |
166
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS GOLD
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Bulk | 518 | - | Surface Mount | SIP | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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Aries Electronics |
79
|
3 jours |
-
|
MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS GOLD
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Bulk | 518 | - | Through Hole | SIP | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Mill-Max Manufacturing Corp. |
45
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS TIN-LEAD
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Bulk | 346 | -55°C ~ 125°C | Through Hole | SIP | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Apex Microtechnology |
22
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS GOLD
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Bulk | Apex Precision Power | - | Through Hole | SIP | Closed Frame | Solder | Polyester，Glass Filled | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS GOLD
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Bulk | 346 | -55°C ~ 125°C | Through Hole | SIP | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
|
Bulk | 346 | -55°C ~ 125°C | Through Hole | SIP | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
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Bulk | 714 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Aries Electronics |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS TIN
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Bulk | 501 | -55°C ~ 105°C | Through Hole | SIP | - | Wire Wrap | Polyamide (PA46)，Nylon 4/6，Glass Filled | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
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Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
|
Bulk | 714 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
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Bulk | 712 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass Alloy | ||
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS TIN
|
Tube | Diplomate DL | -55°C ~ 105°C | Through Hole | SIP | Closed Frame | Solder | Thermoplastic，Glass Filled | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Beryllium Copper | ||
|
|
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS TIN
|
Tube | Diplomate DL | -55°C ~ 105°C | Through Hole | SIP | Closed Frame | Solder | Thermoplastic，Glass Filled | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS TIN
|
Tube | Diplomate DL | -55°C ~ 105°C | Through Hole | SIP | Closed Frame | Solder | Thermoplastic，Glass Filled | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Beryllium Copper | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,067
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
|
Tube | 310 | -55°C ~ 125°C | Through Hole | SIP | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
TE Connectivity AMP Connectors |
1,227
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
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Bulk | 510 | - | Through Hole | SIP | Closed Frame | Solder | Thermoplastic，Polyester | 0.100" (2.54mm) | Gold | 20μin (0.51μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 20μin (0.51μm) | Copper | |||
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Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
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CONN IC SOCKET 20POS
|
Bulk | XR2 | -55°C ~ 125°C | - | Housing | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 0.100" (2.54mm) | - | - | Beryllium Copper | 0.100" (2.54mm) | - | - | Beryllium Copper |
