- Packaging：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Features：
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- Termination：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 76
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Samtec Inc. |
3,282
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS TIN
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Tube | iCF | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Beryllium Copper | ||
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|
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TE Connectivity AMP Connectors |
356
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PQFP 100POS TIN-LEAD
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Tube | - | - | Through Hole | QFP | Closed Frame | Solder | 100 (4 x 25) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | ||
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|
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Samtec Inc. |
468
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
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Tube | iCF | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Beryllium Copper | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PQFP 160POS TIN-LEAD
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Tube | - | - | Through Hole | QFP | Closed Frame | Solder | 160 (4 x 40) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PGA ZIF 370POS GOLD
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Tray | - | - | Through Hole | PGA，ZIF (ZIP) | Open Frame | Solder | 370 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PGA ZIF 370POS GOLD
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Tray | - | - | Through Hole | PGA，ZIF (ZIP) | Open Frame | Solder | 370 (19 x 19) | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PGA ZIF 321POS GOLD
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Tray | - | - | Through Hole | PGA，ZIF (ZIP) | Open Frame | Solder | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 321POS GOLD
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Tray | - | - | Through Hole | PGA，ZIF (ZIP) | Open Frame | Solder | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Phosphor Bronze | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 321POS GOLD
|
Tray | - | - | Through Hole | PGA，ZIF (ZIP) | Open Frame | Solder | 321 (19 x 19) | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | 0.100" (2.54mm) | Gold | 15μin (0.38μm) | Phosphor Bronze | ||
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PQFP 160POS TIN-LEAD
|
Tube | - | - | Through Hole | QFP | Closed Frame | Solder | 160 (4 x 40) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PQFP 144POS TIN-LEAD
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Tube | - | - | Through Hole | QFP | Closed Frame | Solder | 144 (4 x 36) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | ||
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|
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PQFP 132POS TIN-LEAD
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Tube | - | - | Through Hole | QFP | Closed Frame | Solder | 132 (4 x 33) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | ||
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PQFP 144POS TIN-LEAD
|
Tube | - | - | Through Hole | QFP | Closed Frame | Solder | 144 (4 x 36) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET PQFP 100POS TIN-LEAD
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Tube | - | - | Through Hole | QFP | Closed Frame | Solder | 100 (4 x 25) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | ||
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Molex，LLC |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET LGA 1366POS GOLD
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Tray | 47594 | - | Surface Mount | LGA | Open Frame | Solder | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||
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Molex，LLC |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET LGA 1366POS GOLD
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Tray | 47594 | - | Surface Mount | LGA | Open Frame | Solder | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.040" (1.01mm) | - | - | - | ||
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PQFP 100POS TIN-LEAD
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Tube | - | - | Through Hole | QFP | Closed Frame | Solder | 100 (4 x 25) | 0.025" (0.64mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | 0.025" (0.64mm) | Tin-Lead | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Samtec Inc. |
263
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | iCF | -55°C ~ 125°C | Surface Mount | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Beryllium Copper | ||
|
|
|
Samtec Inc. |
83
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | iCF | -55°C ~ 125°C | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Beryllium Copper | ||
|
|
|
Samtec Inc. |
544
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 44POS TIN
|
Tube | PLCC | -55°C ~ 125°C | Surface Mount | PLCC | Closed Frame | Solder | 44 (4 x 11) | 0.050" (1.27mm) | Tin | - | Beryllium Copper | 0.100" (2.54mm) | Tin | - | Beryllium Copper |
