- Series：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 17,400
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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|
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ASSMANN WSW Components |
108,884
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 8 (2 x 4) | 0.100" (2.54mm) | Tin | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
81,814
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 14 (2 x 7) | 0.100" (2.54mm) | Tin | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
48,059
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 16 (2 x 8) | 0.100" (2.54mm) | Tin | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
36,980
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 18 (2 x 9) | 0.100" (2.54mm) | Tin | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
45,190
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 20 (2 x 10) | 0.100" (2.54mm) | Tin | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | ||
|
|
|
ASSMANN WSW Components |
47,594
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Tin | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
8,465
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Tin | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
16,495
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Tin | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
7,338
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Tin | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
8,981
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Thermoplastic，Polyester | 40 (2 x 20) | 0.100" (2.54mm) | Tin | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
364
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 24POS GLD
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Gold | - | Beryllium Copper | ||
|
|
|
Aries Electronics |
2,051
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS GLD
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Gold | - | Beryllium Copper | ||
|
|
|
Aries Electronics |
2,009
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 48POS GLD
|
Bulk | 55 | - | Through Hole | DIP，ZIF (ZIP)，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyphenylene Sulfide (PPS)，Glass Filled | 48 (2 x 24) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Gold | - | Beryllium Copper | ||
|
|
|
3M |
337
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SOIC 16POS GOLD
|
Bulk | Textool | -55°C ~ 150°C | Through Hole | SOIC | Closed Frame | Solder | Polyethersulfone (PES)，Glass Filled | 16 (2 x 8) | - | Gold | Beryllium Copper | - | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
179
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP ZIF 20POS GOLD
|
Bulk | Textool | -55°C ~ 125°C | Through Hole | SIP，ZIF (ZIP) | - | Solder | Polysulfone (PSU)，Glass Filled | 20 (1 x 20) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
138
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP ZIF 24POS GOLD
|
Bulk | Textool | -55°C ~ 125°C | Through Hole | SIP，ZIF (ZIP) | - | Solder | Polysulfone (PSU)，Glass Filled | 24 (1 x 24) | 0.100" (2.54mm) | Gold | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | ||
|
|
|
3M |
110
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PGA ZIF 225POS GOLD
|
Bulk | Textool | -55°C ~ 150°C | - | PGA，ZIF (ZIP) | - | - | Polyethersulfone (PES) | 225 (15 x 15) | 0.100" (2.54mm) | - | - | 0.100" (2.54mm) | - | - | - | ||
|
|
|
3M |
72
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET QFN 64POS GOLD
|
Bulk | Textool | - | Through Hole | QFN | Open Frame | Solder | Polyethersulfone (PES) | 64 (4 x 16) | 0.020" (0.50mm) | Gold | Beryllium Copper | 0.020" (0.50mm) | Gold | - | Beryllium Copper | ||
|
|
|
3M |
43
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET QFN 88POS GOLD
|
Tray | Textool | - | Through Hole | QFN | Open Frame | Solder | Polyethersulfone (PES) | 88 (4 x 22) | 0.016" (0.40mm) | Gold | Beryllium Copper | 0.016" (0.40mm) | Gold | - | Beryllium Copper | ||
|
|
|
ASSMANN WSW Components |
31,632
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | -55°C ~ 85°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT) | 8 (2 x 4) | 0.100" (2.54mm) | Tin | Phosphor Bronze | 0.100" (2.54mm) | Tin | - | Phosphor Bronze |
