- Number of Positions or Pins (Grid)：
-
- Contact Finish Thickness - Mating：
-
- Contact Finish Thickness - Post：
-
- Conditions sélectionnées:
Découvrez les produits 26
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Type | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Type | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | |
|
|
|
3M |
13,906
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
8,449
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
19,400
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
29,466
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
12,215
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
2,201
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
5,074
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
3,528
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
7,760
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
7,416
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
4,405
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS TIN
|
DIP，0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
3,053
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
DIP，0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
4,490
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
2,163
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TIN
|
DIP，0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
1,587
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TIN
|
DIP，0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
2,242
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
DIP，0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
1,711
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
DIP，0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
3,233
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
DIP，0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
589
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
|
DIP，0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 35μin (0.90μm) | 35μin (0.90μm) | ||
|
|
|
3M |
541
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 48POS TIN
|
DIP，0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 35μin (0.90μm) | 35μin (0.90μm) |
