- Packaging:
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- Series:
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- Operating Temperature:
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- Mounting Type:
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- Type:
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- Features:
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- Termination:
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- Housing Material:
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- Number of Positions or Pins (Grid):
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- Pitch - Mating:
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- Pitch - Post:
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- Contact Finish - Post:
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- Contact Finish Thickness - Post:
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- Contact Material - Post:
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- Conditions sélectionnées:
Découvrez les produits 1,377
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
Omron Electronics Inc-EMC Div |
163
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Bulk | XR2 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Wire Wrap | Polybutylene Terephthalate (PBT),Glass Filled | 8 (2 x 4) | 0.100" (2.54mm) | 0.100" (2.54mm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | ||||
Omron Electronics Inc-EMC Div |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Bulk | XR2 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polybutylene Terephthalate (PBT),Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | 0.100" (2.54mm) | Gold | 29.5μin (0.75μm) | Beryllium Copper | ||||
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | D95 | -55°C ~ 125°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Elevated,Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Tube | 114 | -55°C ~ 125°C | Surface Mount | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Bulk | 612 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Tube | 116 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Elevated,Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Tube | 116 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Elevated,Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Tube | 116 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Elevated,Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | 115 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 6 (2 x 3) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | 114 | -55°C ~ 125°C | Surface Mount | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 6 (2 x 3) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | 115 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 6 (2 x 3) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Tube | 116 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Elevated,Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Tube | 122 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Tube | 123 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 6 (2 x 3) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Tube | 121 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 4POS GOLD
|
Tube | 116 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Elevated,Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 4 (2 x 2) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass | ||||
Preci-Dip |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT),Polyester,Glass Filled | 6 (2 x 3) | 0.100" (2.54mm) | 0.100" (2.54mm) | Tin | - | Brass |