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- Conditions sélectionnées:
Découvrez les produits 1,765
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Harwin Inc. |
2,062
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 32POS GOLD
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Bulk | D01-997 | -55°C ~ 125°C | Through Hole | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | 32 (1 x 32) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||
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Aries Electronics |
3,340
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 25POS GOLD
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Bulk | 513 | - | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 25 (1 x 25) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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Aries Electronics |
1,290
|
3 jours |
-
|
MOQ: 1 MPQ: 1
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CONN SOCKET SIP 40POS GOLD
|
Bulk | 518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 40 (1 x 40) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Aries Electronics |
2,219
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS TIN
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Bulk | 511 | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 20 (1 x 20) | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | ||
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Harwin Inc. |
3,996
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 6POS GOLD
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Bulk | D01-997 | -55°C ~ 125°C | Through Hole | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | 6 (1 x 6) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||
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Aries Electronics |
8,359
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 8POS GOLD
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Bulk | 518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 8 (1 x 8) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Harwin Inc. |
1,558
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
|
Bulk | D01-997 | -55°C ~ 125°C | Through Hole | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | 20 (1 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||
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Harwin Inc. |
122
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
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Bulk | D01-995 | -55°C ~ 125°C | Through Hole | - | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||
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TE Connectivity AMP Connectors |
2,064
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 10POS GOLD
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Bulk | 500 | - | Through Hole | - | Solder | Thermoplastic | 10 (1 x 10) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | 0.100" (2.54mm) | Gold | - | Beryllium Copper | ||
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Mill-Max Manufacturing Corp. |
240
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 21POS GOLD
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Bulk | 317 | -55°C ~ 125°C | Through Hole | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 21 (1 x 21) | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
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Harwin Inc. |
515
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 32POS GOLD
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Bulk | D01-995 | -55°C ~ 125°C | Through Hole | - | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Glass Filled | 32 (1 x 32) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 196.8μin (5.00μm) | Brass | ||
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Aries Electronics |
743
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
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Bulk | 518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 40 (1 x 40) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
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Aries Electronics |
555
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 25POS GOLD
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Bulk | 503 | - | Through Hole | - | Wire Wrap | Polyamide (PA)，Nylon，Glass Filled | 25 (1 x 25) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Mill-Max Manufacturing Corp. |
202
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 64POS GOLD
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Bulk | 714 | -55°C ~ 125°C | Through Hole | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (1 x 64) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Brass Alloy | ||
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Aries Electronics |
597
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 12POS TIN
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Bulk | 511 | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 12 (1 x 12) | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | ||
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Aries Electronics |
166
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS GOLD
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Bulk | 518 | - | Surface Mount | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
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Aries Electronics |
187
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 25POS TIN
|
Bulk | 511 | -55°C ~ 105°C | Through Hole | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 25 (1 x 25) | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | ||
|
|
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Mill-Max Manufacturing Corp. |
640
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 64POS GOLD
|
Bulk | 346 | -55°C ~ 125°C | Through Hole | - | Press-Fit | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (1 x 64) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
370
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET 21POS .070 STR GOLD
|
Bulk | 317 | -55°C ~ 125°C | Through Hole | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 21 (1 x 21) | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
126
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN SOCKET 16POS .070 STR GOLD
|
Bulk | 317 | -55°C ~ 125°C | Through Hole | - | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 16 (1 x 16) | 0.070" (1.78mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.070" (1.78mm) | Tin | 200μin (5.08μm) | Brass Alloy |
