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- Conditions sélectionnées:
Découvrez les produits 2,882
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Aries Electronics |
2,527
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
518 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
6,009
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
518 | - | Surface Mount | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
3,517
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Lo-PROfile，513 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
1,734
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
518 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
3,340
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 25POS GOLD
|
513 | - | Through Hole | SIP | - | Solder | 25 (1 x 25) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
1,290
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
518 | - | Through Hole | SIP | Open Frame | Solder | 40 (1 x 40) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
2,219
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 20POS TIN
|
511 | -55°C ~ 105°C | Through Hole | SIP | - | Solder | 20 (1 x 20) | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
660
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Vertisockets 800 | - | Through Hole，Right Angle，Vertical | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
4,578
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
518 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
8,359
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 8POS GOLD
|
518 | - | Through Hole | SIP | Open Frame | Solder | 8 (1 x 8) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
2,109
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
518 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
1,199
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
518 | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
1,526
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
518 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
4,385
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
518 | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
191
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
EJECT-A-DIP | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
743
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 40POS GOLD
|
518 | - | Through Hole | SIP | Open Frame | Solder | 40 (1 x 40) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Aries Electronics |
1,026
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
EJECT-A-DIP | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
476
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
EJECT-A-DIP | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
472
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Vertisockets 800 | - | Through Hole，Right Angle，Vertical | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
115
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
|
Lo-PROfile，526 | -55°C ~ 105°C | Through Hole | DIP，ZIF (ZIP) | Closed Frame | Solder | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 10μin (0.25μm) | Beryllium Copper |
