Douilles pour circuits intégrés, transistors - Zui Ai Technology（Taiwan）Company.

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Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Series	Type	Termination	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Finish Thickness - Post
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Series	Type	Termination	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Finish Thickness - Post
	110-93-314-41-801000	Mill-Max Manufacturing Corp.	548	3 jours	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	110	DIP，0.3" (7.62mm) Row Spacing	Solder	14 (2 x 7)	Tin-Lead	200μin (5.08μm)
	110-93-316-41-801000	Mill-Max Manufacturing Corp.	327	3 jours	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	110	DIP，0.3" (7.62mm) Row Spacing	Solder	16 (2 x 8)	Tin-Lead	200μin (5.08μm)
	110-43-314-41-801000	Mill-Max Manufacturing Corp.	414	3 jours	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	110	DIP，0.3" (7.62mm) Row Spacing	Solder	14 (2 x 7)	Tin	200μin (5.08μm)
	110-93-320-41-801000	Mill-Max Manufacturing Corp.	190	3 jours	-	CONN IC DIP SOCKET 20POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS GOLD	110	DIP，0.3" (7.62mm) Row Spacing	Solder	20 (2 x 10)	Tin-Lead	200μin (5.08μm)
	110-43-320-41-801000	Mill-Max Manufacturing Corp.	960	3 jours	-	CONN IC DIP SOCKET 20POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS GOLD	110	DIP，0.3" (7.62mm) Row Spacing	Solder	20 (2 x 10)	Tin	200μin (5.08μm)
	110-13-320-41-801000	Mill-Max Manufacturing Corp.	266	3 jours	-	CONN IC DIP SOCKET 20POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS GOLD	110	DIP，0.3" (7.62mm) Row Spacing	Solder	20 (2 x 10)	Gold	10μin (0.25μm)
	110-43-324-41-801000	Mill-Max Manufacturing Corp.	494	3 jours	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	110	DIP，0.3" (7.62mm) Row Spacing	Solder	24 (2 x 12)	Tin	200μin (5.08μm)
	110-93-624-41-801000	Mill-Max Manufacturing Corp.	117	3 jours	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	110	DIP，0.6" (15.24mm) Row Spacing	Solder	24 (2 x 12)	Tin-Lead	200μin (5.08μm)
	110-93-628-41-801000	Mill-Max Manufacturing Corp.	209	3 jours	-	CONN IC DIP SOCKET 28POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS GOLD	110	DIP，0.6" (15.24mm) Row Spacing	Solder	28 (2 x 14)	Tin-Lead	200μin (5.08μm)
	110-13-324-41-801000	Mill-Max Manufacturing Corp.	709	3 jours	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	110	DIP，0.3" (7.62mm) Row Spacing	Solder	24 (2 x 12)	Gold	10μin (0.25μm)
	110-13-640-41-801000	Mill-Max Manufacturing Corp.	226	3 jours	-	CONN IC DIP SOCKET 40POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 40POS GOLD	110	DIP，0.6" (15.24mm) Row Spacing	Solder	40 (2 x 20)	Gold	10μin (0.25μm)
	110-43-316-41-801000	Mill-Max Manufacturing Corp.	398	3 jours	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	110	DIP，0.3" (7.62mm) Row Spacing	Solder	16 (2 x 8)	Tin	200μin (5.08μm)
	110-13-316-41-801000	Mill-Max Manufacturing Corp.	101	3 jours	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	110	DIP，0.3" (7.62mm) Row Spacing	Solder	16 (2 x 8)	Gold	10μin (0.25μm)
	123-93-316-41-801000	Mill-Max Manufacturing Corp.	176	3 jours	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	123	DIP，0.3" (7.62mm) Row Spacing	Wire Wrap	16 (2 x 8)	Tin-Lead	200μin (5.08μm)
	110-43-318-41-801000	Mill-Max Manufacturing Corp.	568	3 jours	-	CONN IC DIP SOCKET 18POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 18POS GOLD	110	DIP，0.3" (7.62mm) Row Spacing	Solder	18 (2 x 9)	Tin	200μin (5.08μm)
	123-43-316-41-801000	Mill-Max Manufacturing Corp.	117	3 jours	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	123	DIP，0.3" (7.62mm) Row Spacing	Wire Wrap	16 (2 x 8)	Tin	200μin (5.08μm)
	123-43-318-41-801000	Mill-Max Manufacturing Corp.	246	3 jours	-	CONN IC DIP SOCKET 18POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 18POS GOLD	123	DIP，0.3" (7.62mm) Row Spacing	Wire Wrap	18 (2 x 9)	Tin	200μin (5.08μm)
	123-43-624-41-801000	Mill-Max Manufacturing Corp.	210	3 jours	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	123	DIP，0.6" (15.24mm) Row Spacing	Wire Wrap	24 (2 x 12)	Tin	200μin (5.08μm)
	123-43-640-41-801000	Mill-Max Manufacturing Corp.	145	3 jours	-	CONN IC DIP SOCKET 40POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 40POS GOLD	123	DIP，0.6" (15.24mm) Row Spacing	Wire Wrap	40 (2 x 20)	Tin	200μin (5.08μm)
	123-93-320-41-801000	Mill-Max Manufacturing Corp.	213	3 jours	-	CONN IC DIP SOCKET 20POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 20POS GOLD	123	DIP，0.3" (7.62mm) Row Spacing	Wire Wrap	20 (2 x 10)	Tin-Lead	200μin (5.08μm)