- Operating Temperature:
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- Mounting Type:
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- Type:
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- Features:
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- Number of Positions or Pins (Grid):
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- Pitch - Mating:
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- Contact Finish Thickness - Mating:
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- Contact Material - Mating:
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- Pitch - Post:
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- Contact Finish Thickness - Post:
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- Contact Material - Post:
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- Conditions sélectionnées:
Découvrez les produits 122
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | ||
3M |
13,906
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
8,449
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 16 (2 x 8) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
19,400
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
Apex Microtechnology |
999
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-3 8POS GOLD
|
Bulk | Apex Precision Power | - | Through Hole | Transistor,TO-3 | Closed Frame | 8 (Oval) | - | Gold | 30μin (0.76μm) | Beryllium Copper | - | Tin | 200μin (5.08μm) | Brass | ||||
3M |
29,466
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
12,215
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
2,201
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
5,074
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 16 (2 x 8) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
3,528
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
7,760
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 20 (2 x 10) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
7,416
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
4,405
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 32 (2 x 16) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
3,053
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
4,490
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
2,163
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
1,587
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 24 (2 x 12) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
2,242
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
1,711
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
3M |
3,233
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | 4800 | -25°C ~ 85°C | Through Hole | DIP,0.6" (15.24mm) Row Spacing | Open Frame | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 35μin (0.90μm) | Phosphor Bronze | ||||
Samtec Inc. |
1,102
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Bulk | ICA | -55°C ~ 125°C | Through Hole | DIP,0.3" (7.62mm) Row Spacing | Open Frame | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Brass |