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- Conditions sélectionnées:
Découvrez les produits 16,796
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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On Shore Technology Inc. |
4,295
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame，Wash Away | Solder | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
On Shore Technology Inc. |
3,716
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 18POS GOLD
|
Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame，Wash Away | Solder | 18 (2 x 9) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
On Shore Technology Inc. |
2,570
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS GOLD
|
Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame，Wash Away | Solder | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
On Shore Technology Inc. |
1,257
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame，Wash Away | Solder | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
On Shore Technology Inc. |
1,776
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame，Wash Away | Solder | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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Aries Electronics |
16
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC ZIF 84POS GOLD
|
- | 537 | - | Surface Mount | PLCC，ZIF (ZIP) | Closed Frame | - | 84 (4 x 21) | 0.100" (2.54mm) | Gold | 12μin (0.30μm) | - | - | - | - | - | ||
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On Shore Technology Inc. |
896
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame，Wash Away | Solder | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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On Shore Technology Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 6POS GOLD
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Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame，Wash Away | Solder | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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On Shore Technology Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame，Wash Away | Solder | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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On Shore Technology Inc. |
Enquête
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- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame，Wash Away | Solder | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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On Shore Technology Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame，Wash Away | Solder | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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On Shore Technology Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame，Wash Away | Solder | 32 (2 x 16) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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On Shore Technology Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Tube | WMS | -40°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame，Wash Away | Solder | 40 (2 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN TRANSIST TO-5 3POS GOLD
|
- | 8060 | - | - | Transistor，TO-5 | - | Solder | 3 (Round) | - | Gold | - | - | - | - | - | - | ||
|
|
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Adafruit Industries LLC |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS
|
Bulk | - | - | - | DIP，0.3" (7.62mm) Row Spacing | - | - | 28 (2 x 14) | - | - | - | - | - | - | - | - | ||
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|
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ASSMANN WSW Components |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 22POS GOLD
|
- | - | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | - | 22 (2 x 11) | 0.100" (2.54mm) | Gold | - | - | 0.100" (2.54mm) | Gold | - | - | ||
|
|
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TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | ||
|
|
|
TE Connectivity AMP Connectors |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
|
Tube | - | -40°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | 16 (2 x 8) | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 60μin (1.52μm) | Phosphor Bronze |
