- Packaging：
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- Series：
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- Operating Temperature：
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- Mounting Type：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Contact Material - Post：
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- Conditions sélectionnées:
Découvrez les produits 224
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Mill-Max Manufacturing Corp. |
1,051
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS TIN
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Tube | 110 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | Tin | 100μin (2.54μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
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|
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Mill-Max Manufacturing Corp. |
270
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS TINLEAD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | Tin-Lead | 200μin (5.08μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
149
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 50POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 50 (2 x 25) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
208
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
190
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
313
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | Gold | Flash | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
180
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 50POS GOLD
|
Tube | 123 | -55°C ~ 125°C | Through Hole | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 50 (2 x 25) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
130
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 123 | -55°C ~ 125°C | Through Hole | Open Frame | Wire Wrap | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Mill-Max Manufacturing Corp. |
85
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 50POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 50 (2 x 25) | Gold | Flash | Beryllium Copper | Tin | 200μin (5.08μm) | Brass Alloy | ||
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Aries Electronics |
13
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
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Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 40 (2 x 20) | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
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Aries Electronics |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
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Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 50POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 50 (2 x 25) | Gold | 30μin (0.76μm) | Beryllium Copper | Tin-Lead | 200μin (5.08μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
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|
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ASSMANN WSW Components |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS TIN
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Tube | - | -40°C ~ 105°C | Through Hole | Open Frame | Solder | Thermoplastic，Polyester | 64 (2 x 32) | Tin | - | Beryllium Copper | Tin | 200μin (5.08μm) | Beryllium Copper | ||
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Aries Electronics |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 10μin (0.25μm) | Beryllium Copper | Gold | 10μin (0.25μm) | Brass | ||
|
|
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
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Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 50POS GOLD
|
Bulk | 518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 50 (2 x 25) | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Lo-PROfile，513 | - | Through Hole | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | Gold | 10μin (0.25μm) | Beryllium Copper | Gold | 10μin (0.25μm) | Brass | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Tube | 110 | -55°C ~ 125°C | Through Hole | Open Frame | Solder | Polycyclohexylenedimethylene Terephthalate (PCT)，Polyester | 64 (2 x 32) | Gold | 30μin (0.76μm) | Beryllium Copper | Gold | 10μin (0.25μm) | Brass Alloy | ||
|
|
|
Aries Electronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 64POS GOLD
|
Bulk | 518 | - | Through Hole | Open Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 64 (2 x 32) | Gold | 10μin (0.25μm) | Beryllium Copper | Tin | 200μin (5.08μm) | Brass |
