- Mounting Type：
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- Type：
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- Number of Positions or Pins (Grid)：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Conditions sélectionnées:
Découvrez les produits 47
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Mounting Type | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Mounting Type | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | |
|
|
|
Mill-Max Manufacturing Corp. |
5,288
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30μin (0.76μm) | Tin | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Through Hole | DIP，0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30μin (0.76μm) | Tin | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,255
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Through Hole | DIP，0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30μin (0.76μm) | Tin | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,074
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Through Hole | DIP，0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30μin (0.76μm) | Tin | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,938
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30μin (0.76μm) | Tin-Lead | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,600
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30μin (0.76μm) | Tin | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,057
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30μin (0.76μm) | Tin-Lead | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,550
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30μin (0.76μm) | Tin | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,778
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
|
Through Hole | DIP，0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30μin (0.76μm) | Tin-Lead | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
1,052
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30μin (0.76μm) | Tin | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
167
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Through Hole | DIP，0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30μin (0.76μm) | Tin-Lead | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
127
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Through Hole | DIP，0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30μin (0.76μm) | Tin-Lead | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
936
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30μin (0.76μm) | Tin-Lead | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
914
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Through Hole | DIP，0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30μin (0.76μm) | Tin-Lead | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
321
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Through Hole | DIP，0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30μin (0.76μm) | Tin-Lead | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
140
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Through Hole | DIP，0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 30μin (0.76μm) | Tin | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
330
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
|
Surface Mount | DIP，0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Tin | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
276
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
|
Surface Mount | DIP，0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | Flash | Tin | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
208
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Surface Mount | DIP，0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Tin | 200μin (5.08μm) | ||
|
|
|
Mill-Max Manufacturing Corp. |
198
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 24POS GOLD
|
Surface Mount | DIP，0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | Flash | Tin | 200μin (5.08μm) |
