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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Material - Mating：
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- Conditions sélectionnées:
Découvrez les produits 1,936
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | |
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Aries Electronics |
2,219
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET SIP 20POS TIN
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Bulk | 511 | Through Hole | SIP | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 20 (1 x 20) | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | ||
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|
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Amphenol FCI |
25,910
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3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 8POS TIN
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Tube | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA)，Nylon | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||
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|
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Amphenol FCI |
5,564
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Tube | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA)，Nylon | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||
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|
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Amphenol FCI |
22,435
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS TIN
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Tube | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA)，Nylon | 16 (2 x 8) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||
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|
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Amphenol FCI |
5,641
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 20POS TIN
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Tube | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyamide (PA)，Nylon | 20 (2 x 10) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||
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|
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Amphenol FCI |
13,070
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS TIN
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Tube | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyamide (PA)，Nylon | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||
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|
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Amphenol FCI |
9,259
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS TIN
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Tube | - | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyamide (PA)，Nylon | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | 0.100" (2.54mm) | Tin | 100μin (2.54μm) | Copper Alloy | ||
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|
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CnC Tech |
5,739
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 44POS TIN
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Tube | - | Surface Mount | PLCC | Closed Frame | Solder | Polybutylene Terephthalate (PBT)，Glass Filled | 44 (4 x 11) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | ||
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TE Connectivity AMP Connectors |
386
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS GOLD
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Tube | 800 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Beryllium Copper | 0.100" (2.54mm) | - | - | Copper Alloy | ||
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|
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Aries Electronics |
191
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 16POS GOLD
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Bulk | EJECT-A-DIP | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
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Aries Electronics |
1,026
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 28POS GOLD
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Bulk | EJECT-A-DIP | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
|
Aries Electronics |
476
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 40POS GOLD
|
Bulk | EJECT-A-DIP | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
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|
|
Aries Electronics |
115
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 28POS TIN
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Bulk | Lo-PROfile，526 | Through Hole | DIP，ZIF (ZIP) | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 28 (2 x 14) | 0.100" (2.54mm) | Tin | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 10μin (0.25μm) | Beryllium Copper | ||
|
|
|
Aries Electronics |
107
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET ZIF 40POS TIN
|
Bulk | Lo-PROfile，526 | Through Hole | DIP，ZIF (ZIP) | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 10μin (0.25μm) | Beryllium Copper | ||
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|
|
CnC Tech |
2,878
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET PLCC 32POS TIN
|
Tube | - | Surface Mount | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 32 (4 x 8) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | ||
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|
|
Aries Electronics |
200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 14POS TIN
|
Bulk | 8 | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Closed Frame，Elevated | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
597
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 12POS TIN
|
Bulk | 511 | Through Hole | SIP | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 12 (1 x 12) | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
187
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN SOCKET SIP 25POS TIN
|
Bulk | 511 | Through Hole | SIP | - | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 25 (1 x 25) | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | 0.100" (2.54mm) | Tin | 50μin (1.27μm) | Phosphor Bronze | ||
|
|
|
Aries Electronics |
231
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 32POS GOLD
|
Bulk | EJECT-A-DIP | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 10μin (0.25μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass | ||
|
|
|
Aries Electronics |
588
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONN IC DIP SOCKET 10POS GOLD
|
Bulk | Vertisockets 800 | Through Hole，Right Angle，Horizontal | DIP，0.2" (5.08mm) Row Spacing | Closed Frame | Solder | Polyamide (PA46)，Nylon 4/6，Glass Filled | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 30μin (0.76μm) | Beryllium Copper | 0.100" (2.54mm) | Tin | 200μin (5.08μm) | Brass |
