- Packaging：
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- Series：
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- Operating Temperature：
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- Mounting Type：
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- Type：
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- Termination：
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- Housing Material：
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- Number of Positions or Pins (Grid)：
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- Pitch - Mating：
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- Contact Finish - Mating：
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- Contact Finish Thickness - Mating：
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- Contact Material - Mating：
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- Pitch - Post：
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- Contact Finish - Post：
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- Contact Finish Thickness - Post：
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- Conditions sélectionnées:
Découvrez les produits 16,808
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Mounting Type | Type | Features | Termination | Housing Material | Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | |
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3M |
110
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PGA ZIF 225POS GOLD
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Bulk | Textool | -55°C ~ 150°C | - | PGA，ZIF (ZIP) | - | - | Polyethersulfone (PES) | 225 (15 x 15) | 0.100" (2.54mm) | - | - | - | 0.100" (2.54mm) | - | - | ||
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TE Connectivity AMP Connectors |
9,620
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Copper Alloy | 0.100" (2.54mm) | - | - | ||
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TE Connectivity AMP Connectors |
1,530
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 28POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyester | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 5μin (0.127μm) | Copper Alloy | 0.100" (2.54mm) | - | - | ||
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TE Connectivity AMP Connectors |
1,060
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3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 16POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyester | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Copper Alloy | 0.100" (2.54mm) | - | - | ||
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|
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TE Connectivity AMP Connectors |
996
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 36POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.6" (15.24mm) Row Spacing | Open Frame | Solder | Polyester | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Copper Alloy | 0.100" (2.54mm) | - | - | ||
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Aries Electronics |
16
|
3 jours |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC ZIF 84POS GOLD
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- | 537 | - | Surface Mount | PLCC，ZIF (ZIP) | Closed Frame | - | - | 84 (4 x 21) | 0.100" (2.54mm) | Gold | 12μin (0.30μm) | - | - | - | - | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 8POS TIN-LEAD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyester | 8 (2 x 4) | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | 0.100" (2.54mm) | - | - | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 14POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | Solder | Polyester | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25μin (0.63μm) | Copper Alloy | 0.100" (2.54mm) | - | - | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 64POS GOLD
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Tube | 800 | -55°C ~ 105°C | Through Hole | DIP，0.9" (22.86mm) Row Spacing | Open Frame | Solder | Polyester | 64 (2 x 32) | 0.100" (2.54mm) | Gold | Flash | Copper Alloy | 0.100" (2.54mm) | - | - | ||
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TE Connectivity AMP Connectors |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN TRANSIST TO-5 3POS GOLD
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- | 8060 | - | - | Transistor，TO-5 | - | Solder | - | 3 (Round) | - | Gold | - | - | - | - | - | ||
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Molex，LLC |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET LGA 2011POS GOLD
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Tray | 105142 | - | Surface Mount | LGA | Open Frame | Solder | Thermoplastic | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 15μin (0.38μm) | Copper Alloy | 0.040" (1.01mm) | - | - | ||
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Molex，LLC |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET LGA 2011POS GOLD
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Tray | 105142 | - | Surface Mount | LGA | Open Frame | Solder | Thermoplastic | 2011 (47 x 58) | 0.040" (1.02mm) | Gold | 30μin (0.76μm) | Copper Alloy | 0.040" (1.01mm) | - | - | ||
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Adafruit Industries LLC |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 28POS
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Bulk | - | - | - | DIP，0.3" (7.62mm) Row Spacing | - | - | - | 28 (2 x 14) | - | - | - | - | - | - | - | ||
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ASSMANN WSW Components |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN IC DIP SOCKET 22POS GOLD
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- | - | - | Through Hole | DIP，0.3" (7.62mm) Row Spacing | Open Frame | - | - | 22 (2 x 11) | 0.100" (2.54mm) | Gold | - | - | 0.100" (2.54mm) | Gold | - | ||
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 28POS TIN-LEAD
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Tube | 540 | - | Through Hole | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 28 (4 x 7) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | - | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | ||
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 32POS TIN-LEAD
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Tube | 540 | - | Through Hole | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 32 (2 x 7，2 x 9) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | - | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | ||
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 44POS TIN-LEAD
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Tube | 540 | - | Through Hole | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 44 (4 x 11) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | - | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | ||
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 52POS TIN-LEAD
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Tube | 540 | - | Through Hole | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 52 (4 x 13) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | - | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | ||
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 68POS TIN-LEAD
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Tube | 540 | - | Through Hole | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 68 (4 x 17) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | - | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | ||
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|
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Mill-Max Manufacturing Corp. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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CONN SOCKET PLCC 84POS TIN-LEAD
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Tube | 540 | - | Through Hole | PLCC | Closed Frame | Solder | Polyphenylene Sulfide (PPS) | 84 (4 x 21) | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) | - | 0.050" (1.27mm) | Tin-Lead | 200μin (5.08μm) |
