Douilles pour circuits intégrés, transistors - Zui Ai Technology（Taiwan）Company.

Conditions sélectionnées:

Découvrez les produits 122

Comparer Ajouter au panier Ajouter au devis

Page 1 / 7

Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Operating Temperature	Mounting Type	Type	Termination	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Contact Finish Thickness - Post
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Operating Temperature	Mounting Type	Type	Termination	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Contact Finish Thickness - Post
	16-C280-10	Aries Electronics	191	3 jours	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Solder	16 (2 x 8)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)
	28-C182-10	Aries Electronics	1,026	3 jours	-	CONN IC DIP SOCKET 28POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Solder	28 (2 x 14)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)
	40-C182-10	Aries Electronics	476	3 jours	-	CONN IC DIP SOCKET 40POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 40POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Solder	40 (2 x 20)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)
	32-C182-10	Aries Electronics	231	3 jours	-	CONN IC DIP SOCKET 32POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 32POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Solder	32 (2 x 16)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)
	24-C182-10	Aries Electronics	65	3 jours	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Solder	24 (2 x 12)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)
	40-C212-10	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 40POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 40POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Solder	40 (2 x 20)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)
	14-C280-10	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Solder	14 (2 x 7)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)
	40-C182-11	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 40POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 40POS GOLD	-55°C ~ 125°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Solder	40 (2 x 20)	Gold	10μin (0.25μm)	Gold	10μin (0.25μm)
	14-C280-10T	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 14POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS TIN	-55°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Solder	14 (2 x 7)	Tin	200μin (5.08μm)	Tin	200μin (5.08μm)
	14-C195-10T	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 14POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS TIN	-55°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Solder	14 (2 x 7)	Tin	200μin (5.08μm)	Tin	200μin (5.08μm)
	14-C195-10	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Solder	14 (2 x 7)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)
	16-C195-10	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Solder	16 (2 x 8)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)
	14-C195-11	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Solder	14 (2 x 7)	Gold	10μin (0.25μm)	Gold	10μin (0.25μm)
	14-C280-11	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 14POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 14POS GOLD	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Solder	14 (2 x 7)	Gold	10μin (0.25μm)	Gold	10μin (0.25μm)
	28-C212-10T	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 28POS TIN MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 28POS TIN	-55°C ~ 105°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Solder	28 (2 x 14)	Tin	200μin (5.08μm)	Tin	200μin (5.08μm)
	16-C195-11	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Solder	16 (2 x 8)	Gold	10μin (0.25μm)	Gold	10μin (0.25μm)
	16-C280-11	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	-55°C ~ 125°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Solder	16 (2 x 8)	Gold	10μin (0.25μm)	Gold	10μin (0.25μm)
	24-C212-10	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Solder	24 (2 x 12)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)
	24-C300-10	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 24POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 24POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.6" (15.24mm) Row Spacing	Solder	24 (2 x 12)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)
	16-C195-10H	Aries Electronics	Enquête	-	-	CONN IC DIP SOCKET 16POS GOLD MOQ: 1 MPQ: 1	CONN IC DIP SOCKET 16POS GOLD	-55°C ~ 105°C	Through Hole	DIP，0.3" (7.62mm) Row Spacing	Solder	16 (2 x 8)	Gold	10μin (0.25μm)	Tin	200μin (5.08μm)