Termination:
Contact Finish - Mating:
Contact Finish - Post:
Découvrez les produits 218
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Series Operating Temperature Mounting Type Type Features Termination Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post
ED281DT
On Shore Technology Inc.
28,344
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 28POS TIN
Tube ED -55°C ~ 110°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 28 (2 x 14) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
8432-21B1-RK-TR
3M
6,300
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 32POS TIN
Tape & Reel (TR) 8400 -40°C ~ 105°C Surface Mount PLCC Closed Frame Solder 32 (2 x 7,2 x 9) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
8432-21B1-RK-TR
3M
6,697
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 32POS TIN
Cut Tape (CT) 8400 -40°C ~ 105°C Surface Mount PLCC Closed Frame Solder 32 (2 x 7,2 x 9) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
8432-21B1-RK-TR
3M
6,697
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 32POS TIN
- 8400 -40°C ~ 105°C Surface Mount PLCC Closed Frame Solder 32 (2 x 7,2 x 9) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
8444-21B1-RK-TR
3M
1,440
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Tape & Reel (TR) 8400 -40°C ~ 105°C Surface Mount PLCC Closed Frame Solder 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
8444-21B1-RK-TR
3M
1,583
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Cut Tape (CT) 8400 -40°C ~ 105°C Surface Mount PLCC Closed Frame Solder 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
8444-21B1-RK-TR
3M
1,583
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
- 8400 -40°C ~ 105°C Surface Mount PLCC Closed Frame Solder 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
8444-21B1-RK-TP
3M
3,289
3 jours
-
MOQ: 1  MPQ: 1
CONN SOCKET PLCC 44POS TIN
Tube 8400 -40°C ~ 105°C Surface Mount PLCC Closed Frame Solder 44 (4 x 11) 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy 0.050" (1.27mm) Tin 160μin (4.06μm) Copper Alloy
ED08DT
On Shore Technology Inc.
17,786
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 8POS TIN
Tube ED -55°C ~ 110°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 8 (2 x 4) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
ED14DT
On Shore Technology Inc.
10,923
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 14POS TIN
Tube ED -55°C ~ 110°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 14 (2 x 7) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
ED16DT
On Shore Technology Inc.
3,583
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 16POS TIN
Tube ED -55°C ~ 110°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 16 (2 x 8) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
243-08-1-03
CnC Tech
15,341
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 8POS TIN
Tube - -40°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 8 (2 x 4) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
ED18DT
On Shore Technology Inc.
14,114
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 18POS TIN
Tube ED -55°C ~ 110°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 18 (2 x 9) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
ED06DT
On Shore Technology Inc.
10,289
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 6POS TIN
Tube ED -55°C ~ 110°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 6 (2 x 3) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
245-08-1-03
CnC Tech
8,646
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 8POS TIN
Tube - -40°C ~ 105°C Through Hole,Kinked Pin DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 8 (2 x 4) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
243-16-1-03
CnC Tech
6,405
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 16POS TIN
Tube - -40°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 16 (2 x 8) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
ED20DT
On Shore Technology Inc.
6,430
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 20POS TIN
Tube ED -55°C ~ 110°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 20 (2 x 10) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
ED24DT
On Shore Technology Inc.
11,370
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 24POS TIN
Tube ED -55°C ~ 110°C Through Hole DIP,0.6" (15.24mm) Row Spacing Open Frame Solder 24 (2 x 12) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
ED241DT
On Shore Technology Inc.
4,636
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 24POS TIN
Tube ED -55°C ~ 110°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 24 (2 x 12) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze
243-20-1-03
CnC Tech
21,928
3 jours
-
MOQ: 1  MPQ: 1
CONN IC DIP SOCKET 20POS TIN
Tube - -40°C ~ 105°C Through Hole DIP,0.3" (7.62mm) Row Spacing Open Frame Solder 20 (2 x 10) 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze 0.100" (2.54mm) Tin 60μin (1.52μm) Phosphor Bronze